JPS55501202A - - Google Patents

Info

Publication number
JPS55501202A
JPS55501202A JP50048480A JP50048480A JPS55501202A JP S55501202 A JPS55501202 A JP S55501202A JP 50048480 A JP50048480 A JP 50048480A JP 50048480 A JP50048480 A JP 50048480A JP S55501202 A JPS55501202 A JP S55501202A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50048480A
Other versions
JPS6236384B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS55501202A publication Critical patent/JPS55501202A/ja
Publication of JPS6236384B2 publication Critical patent/JPS6236384B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6312—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group III-V semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6319—Formation by plasma treatments, e.g. plasma oxidation of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6322—Formation by thermal treatments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H10P95/904—Thermal treatments, e.g. annealing or sintering of Group III-V semiconductors

Landscapes

  • Formation Of Insulating Films (AREA)
JP55500484A 1979-02-14 1980-01-31 Expired JPS6236384B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/012,192 US4246296A (en) 1979-02-14 1979-02-14 Controlling the properties of native films using selective growth chemistry

Publications (2)

Publication Number Publication Date
JPS55501202A true JPS55501202A (ja) 1980-12-25
JPS6236384B2 JPS6236384B2 (ja) 1987-08-06

Family

ID=21753790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55500484A Expired JPS6236384B2 (ja) 1979-02-14 1980-01-31

Country Status (5)

Country Link
US (1) US4246296A (ja)
EP (1) EP0023911B1 (ja)
JP (1) JPS6236384B2 (ja)
DE (1) DE3070692D1 (ja)
WO (1) WO1980001738A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04234121A (ja) * 1990-09-20 1992-08-21 American Teleph & Telegr Co <Att> 集積回路デバイスの製造方法
JPH06177123A (ja) * 1990-07-19 1994-06-24 American Teleph & Telegr Co <Att> 絶縁体の堆積方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662328A (en) * 1979-10-26 1981-05-28 Agency Of Ind Science & Technol Manufacturing of insulation membrane and insulation membrane-semiconductor interface
US4421785A (en) * 1980-08-18 1983-12-20 Sperry Corporation Superconductive tunnel junction device and method of manufacture
US4368550A (en) * 1981-04-10 1983-01-18 Stevens Gunther A Method and apparatus for winterizing a swimming pool
US4544418A (en) * 1984-04-16 1985-10-01 Gibbons James F Process for high temperature surface reactions in semiconductor material
US4588451A (en) * 1984-04-27 1986-05-13 Advanced Energy Fund Limited Partnership Metal organic chemical vapor deposition of 111-v compounds on silicon
DE4017870A1 (de) * 1990-06-02 1991-12-05 Standard Elektrik Lorenz Ag Verfahren zur herstellung und passivierung von halbleiterbauelementen
JPH0883902A (ja) * 1994-09-09 1996-03-26 Mitsubishi Electric Corp 半導体装置の製造方法、及び半導体装置
US5563105A (en) * 1994-09-30 1996-10-08 International Business Machines Corporation PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element
JPH09139494A (ja) * 1995-11-16 1997-05-27 Mitsubishi Electric Corp 半導体装置の製造方法，及び半導体装置
JP3489334B2 (ja) * 1996-05-27 2004-01-19 ソニー株式会社 半導体装置の酸化膜形成方法および酸化膜形成装置
US5872031A (en) * 1996-11-27 1999-02-16 The Regents Of The University Of California Enhancement-depletion logic based on gaas mosfets
US6472695B1 (en) 1999-06-18 2002-10-29 The Regents Of The University Of California Increased lateral oxidation rate of aluminum indium arsenide

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991263A (en) * 1963-02-15 1965-05-05 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3287243A (en) * 1965-03-29 1966-11-22 Bell Telephone Labor Inc Deposition of insulating films by cathode sputtering in an rf-supported discharge
US3692571A (en) * 1970-11-12 1972-09-19 Northern Electric Co Method of reducing the mobile ion contamination in thermally grown silicon dioxide
US3849276A (en) * 1971-03-19 1974-11-19 Ibm Process for forming reactive layers whose thickness is independent of time
US3890169A (en) * 1973-03-26 1975-06-17 Bell Telephone Labor Inc Method of forming stable native oxide on gallium arsenide based compound semiconductors by combined drying and annealing
US3914465A (en) * 1972-09-25 1975-10-21 Bell Telephone Labor Inc Surface passivation of GaAs junction laser devices
US3907616A (en) * 1972-11-15 1975-09-23 Texas Instruments Inc Method of forming doped dielectric layers utilizing reactive plasma deposition
US4062747A (en) * 1976-06-15 1977-12-13 Bell Telephone Laboratories, Incorporated Native growth of semiconductor oxide layers
US4172906A (en) * 1977-05-11 1979-10-30 Rockwell International Corporation Method for passivating III-V compound semiconductors
US4170666A (en) * 1977-05-11 1979-10-09 Rockwell International Corporation Method for reducing surface recombination velocities in III-V compound semiconductors
US4144634A (en) * 1977-06-28 1979-03-20 Bell Telephone Laboratories, Incorporated Fabrication of gallium arsenide MOS devices
US4183780A (en) * 1978-08-21 1980-01-15 International Business Machines Corporation Photon enhanced reactive ion etching

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177123A (ja) * 1990-07-19 1994-06-24 American Teleph & Telegr Co <Att> 絶縁体の堆積方法
JPH04234121A (ja) * 1990-09-20 1992-08-21 American Teleph & Telegr Co <Att> 集積回路デバイスの製造方法

Also Published As

Publication number Publication date
JPS6236384B2 (ja) 1987-08-06
EP0023911B1 (en) 1985-05-29
EP0023911A1 (en) 1981-02-18
EP0023911A4 (en) 1983-03-15
US4246296A (en) 1981-01-20
DE3070692D1 (en) 1985-07-04
WO1980001738A1 (en) 1980-08-21

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