JPS5552247A - Manufacture of electronic device - Google Patents

Manufacture of electronic device

Info

Publication number
JPS5552247A
JPS5552247A JP12555578A JP12555578A JPS5552247A JP S5552247 A JPS5552247 A JP S5552247A JP 12555578 A JP12555578 A JP 12555578A JP 12555578 A JP12555578 A JP 12555578A JP S5552247 A JPS5552247 A JP S5552247A
Authority
JP
Japan
Prior art keywords
surface wave
resin
paraffin
vacant space
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12555578A
Other languages
Japanese (ja)
Inventor
Katsuaki Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12555578A priority Critical patent/JPS5552247A/en
Publication of JPS5552247A publication Critical patent/JPS5552247A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide a method of manufacturing a module comprising an elastic- surface wave element and a semiconductor integrated circuit element in which the formation of a vacant space on the surface wave element is made available with ease and low costs and the reliability thereof is improved by using a porous resin and a wet-proof resin to cover the surface wave element.
CONSTITUTION: An elastic-surface wave filter 13 consisting of a piezo-electric substrate 11 and a pair of toothed electrodes 12 mounted thereon, and a peripheral circuit semiconductor element 14 are mounted on a lead frame 15. Paraffin is applied to the input and output electrodes and the surface wave propagating route of the filter 13 to form a paraffin coating layer 16, which is then overlaid by a layer 17 consisting of a porous resin such as phenol, followed by heating. As a result, the paraffin 16 is molten into the phenol resin 17 to leave a vacant space 18 in the form of layer. The entirety of the resulting module is sealed in a mass of epoxy or silicone resin having an excellent airtight preperty. Thus the formation of the vacant space as well as the protection of the module device can be obtained very simply at reduced costs.
COPYRIGHT: (C)1980,JPO&Japio
JP12555578A 1978-10-11 1978-10-11 Manufacture of electronic device Pending JPS5552247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12555578A JPS5552247A (en) 1978-10-11 1978-10-11 Manufacture of electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12555578A JPS5552247A (en) 1978-10-11 1978-10-11 Manufacture of electronic device

Publications (1)

Publication Number Publication Date
JPS5552247A true JPS5552247A (en) 1980-04-16

Family

ID=14913088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12555578A Pending JPS5552247A (en) 1978-10-11 1978-10-11 Manufacture of electronic device

Country Status (1)

Country Link
JP (1) JPS5552247A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276647A (en) * 1991-03-05 1992-10-01 Murata Mfg Co Ltd Electronic component
JP2023549312A (en) * 2020-10-23 2023-11-24 ウルフスピード インコーポレイテッド RF package with internal moisture barrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276647A (en) * 1991-03-05 1992-10-01 Murata Mfg Co Ltd Electronic component
JP2023549312A (en) * 2020-10-23 2023-11-24 ウルフスピード インコーポレイテッド RF package with internal moisture barrier

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