JPS5552247A - Manufacture of electronic device - Google Patents

Manufacture of electronic device

Info

Publication number: JPS5552247A
Authority: JP; Japan
Prior art keywords: surface wave; resin; paraffin; vacant space; module
Prior art date: 1978-10-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP12555578A

Other languages

English (en)

Inventor

Katsuaki Yanagisawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

NEC Corp

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-10-11

Filing date

1978-10-11

Publication date

1980-04-16

1978-10-11 Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp

1978-10-11 Priority to JP12555578A priority Critical patent/JPS5552247A/ja

1980-04-16 Publication of JPS5552247A publication Critical patent/JPS5552247A/ja

Status Pending legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title abstract 2
239000012188 paraffin wax Substances 0.000 abstract 3
229920005989 resin Polymers 0.000 abstract 3
239000011347 resin Substances 0.000 abstract 3
230000015572 biosynthetic process Effects 0.000 abstract 2
239000010410 layer Substances 0.000 abstract 2
239000004065 semiconductor Substances 0.000 abstract 2
239000004593 Epoxy Substances 0.000 abstract 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
239000011247 coating layer Substances 0.000 abstract 1
238000010438 heat treatment Methods 0.000 abstract 1
230000002093 peripheral effect Effects 0.000 abstract 1
239000005011 phenolic resin Substances 0.000 abstract 1
229920000647 polyepoxide Polymers 0.000 abstract 1
230000001902 propagating effect Effects 0.000 abstract 1
229920002050 silicone resin Polymers 0.000 abstract 1
239000000758 substrate Substances 0.000 abstract 1

Landscapes

Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

JP12555578A 1978-10-11 1978-10-11 Manufacture of electronic device Pending JPS5552247A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP12555578A JPS5552247A (en)	1978-10-11	1978-10-11	Manufacture of electronic device

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP12555578A JPS5552247A (en)	1978-10-11	1978-10-11	Manufacture of electronic device

Publications (1)

Publication Number	Publication Date
JPS5552247A true JPS5552247A (en)	1980-04-16

Family

ID=14913088

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP12555578A Pending JPS5552247A (en)	1978-10-11	1978-10-11	Manufacture of electronic device

Country Status (1)

Country	Link
JP (1)	JPS5552247A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04276647A (ja) *	1991-03-05	1992-10-01	Murata Mfg Co Ltd	圧電振動部品
JP2023549312A (ja) *	2020-10-23	2023-11-24	ウルフスピードインコーポレイテッド	内部防湿層を備えるｒｆパッケージ

1978
- 1978-10-11 JP JP12555578A patent/JPS5552247A/ja active Pending

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04276647A (ja) *	1991-03-05	1992-10-01	Murata Mfg Co Ltd	圧電振動部品
JP2023549312A (ja) *	2020-10-23	2023-11-24	ウルフスピードインコーポレイテッド	内部防湿層を備えるｒｆパッケージ

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