JPS5577151A - Heat treatment device for semiconductor wafer - Google Patents

Heat treatment device for semiconductor wafer

Info

Publication number
JPS5577151A
JPS5577151A JP15089578A JP15089578A JPS5577151A JP S5577151 A JPS5577151 A JP S5577151A JP 15089578 A JP15089578 A JP 15089578A JP 15089578 A JP15089578 A JP 15089578A JP S5577151 A JPS5577151 A JP S5577151A
Authority
JP
Japan
Prior art keywords
wafer
heat treatment
treatment device
tilted
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15089578A
Other languages
Japanese (ja)
Inventor
Osamu Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP15089578A priority Critical patent/JPS5577151A/en
Publication of JPS5577151A publication Critical patent/JPS5577151A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To accomplish even treatment by preventing wafers from contacting each other with the heat treatment device tilted by a given angle.
CONSTITUTION: The vertical section 1 of a wafer is tilted by 0.5W20° from the frame base with respect to the plane. As a result, even if the groove 6 of the vertical section 1 is slightly larger in width than a wafer 5. The wafer is tilted in the same direction as the section and thus, groove spaces are maintained equal anywhere on the wafer thereby preventing wafers from contacting each other. In this manner, the wafer can be treated evenly.
COPYRIGHT: (C)1980,JPO&Japio
JP15089578A 1978-12-05 1978-12-05 Heat treatment device for semiconductor wafer Pending JPS5577151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15089578A JPS5577151A (en) 1978-12-05 1978-12-05 Heat treatment device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15089578A JPS5577151A (en) 1978-12-05 1978-12-05 Heat treatment device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5577151A true JPS5577151A (en) 1980-06-10

Family

ID=15506716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15089578A Pending JPS5577151A (en) 1978-12-05 1978-12-05 Heat treatment device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5577151A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010280966A (en) * 2009-06-05 2010-12-16 Toyota Motor Corp Hardening jig

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010280966A (en) * 2009-06-05 2010-12-16 Toyota Motor Corp Hardening jig

Similar Documents

Publication Publication Date Title
JPS5390033A (en) Heat treatment equipment
JPS5285476A (en) Semiconductor wafer accommodating jig
JPS5577151A (en) Heat treatment device for semiconductor wafer
JPS5318967A (en) Wafer sucking jig
JPS5240059A (en) Process for production of semiconductor device
JPS5424571A (en) Manufacture for semiconductor wafer
JPS5245874A (en) Transfer device of semiconductor substrate holding device
JPS5413777A (en) Photo resist coater of semiconductor wafers
JPS522163A (en) Wafer cleaning and drying device
JPS5329679A (en) Junction type field effect semiconductor device
JPS5362476A (en) Processing method of semiconductor surface
JPS5242365A (en) Tool for semiconductors
JPS5273673A (en) Production of semiconductor device
JPS52150974A (en) Semiconductor wafer treatment apparatus
JPS52156552A (en) Wafer inspection apparatus
JPS52149968A (en) Heat treatment method of semiconductor wafers
JPS5377178A (en) Chuking device of semiconductor element substrate
JPS53108373A (en) Manufacture for semiconductor device
JPS53147479A (en) Production of semiconductor device
JPS5339872A (en) Etching method of wafers
JPS52124869A (en) Treatment jig for semiconductor wafers
JPS53102668A (en) Manufacture for semiconductor device
JPS5216971A (en) Base plate heat treatment method and wafer for semiconductor
JPS51130167A (en) Semiconductor device manufacturing method
JPS5271981A (en) Aligning device for bonders