JPS5583236A - Cutting method for semiconductor wafer - Google Patents
Cutting method for semiconductor waferInfo
- Publication number
- JPS5583236A JPS5583236A JP15646878A JP15646878A JPS5583236A JP S5583236 A JPS5583236 A JP S5583236A JP 15646878 A JP15646878 A JP 15646878A JP 15646878 A JP15646878 A JP 15646878A JP S5583236 A JPS5583236 A JP S5583236A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- bonded
- semiconductor wafer
- cutting method
- mixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000008188 pellet Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To allow judging pellet for acceptance or rejection while the pellet is being bonded on base by using electric conductive adhesive.
CONSTITUTION: Powder of Fe, Al, Cu, Ni, etc. is mixed into conventional tar or rosin based thermoplastic resin in amount of 5W80%. If the mixed amount is less than 5%, electric conductivity is poor. If it exceeds 80%, adhesivity is reduced and cutting property by sandblast becomes poor. Using the adhesive allows pellet inspection which is bonded on base plate and therefore is convenient.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15646878A JPS5583236A (en) | 1978-12-20 | 1978-12-20 | Cutting method for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15646878A JPS5583236A (en) | 1978-12-20 | 1978-12-20 | Cutting method for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5583236A true JPS5583236A (en) | 1980-06-23 |
Family
ID=15628397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15646878A Pending JPS5583236A (en) | 1978-12-20 | 1978-12-20 | Cutting method for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5583236A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001075954A1 (en) * | 2000-03-31 | 2001-10-11 | Toyoda Gosei Co., Ltd. | Method for dicing semiconductor wafer into chips |
| WO2003105244A1 (en) * | 2002-01-01 | 2003-12-18 | 古河電気工業株式会社 | Thermoelectric element module and method for fabricating the same |
| CN102240987A (en) * | 2011-05-30 | 2011-11-16 | 上海百兰朵电子科技有限公司 | Synthetic copper plate grinding disk |
-
1978
- 1978-12-20 JP JP15646878A patent/JPS5583236A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001075954A1 (en) * | 2000-03-31 | 2001-10-11 | Toyoda Gosei Co., Ltd. | Method for dicing semiconductor wafer into chips |
| US7121925B2 (en) | 2000-03-31 | 2006-10-17 | Toyoda Gosei Co., Ltd. | Method for dicing semiconductor wafer into chips |
| WO2003105244A1 (en) * | 2002-01-01 | 2003-12-18 | 古河電気工業株式会社 | Thermoelectric element module and method for fabricating the same |
| CN102240987A (en) * | 2011-05-30 | 2011-11-16 | 上海百兰朵电子科技有限公司 | Synthetic copper plate grinding disk |
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