JPS5592015A - Hermetic vessel sealing unit of piezo-vibrator - Google Patents

Hermetic vessel sealing unit of piezo-vibrator

Info

Publication number
JPS5592015A
JPS5592015A JP16397178A JP16397178A JPS5592015A JP S5592015 A JPS5592015 A JP S5592015A JP 16397178 A JP16397178 A JP 16397178A JP 16397178 A JP16397178 A JP 16397178A JP S5592015 A JPS5592015 A JP S5592015A
Authority
JP
Japan
Prior art keywords
high frequency
melting point
point metal
joint material
metal joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16397178A
Other languages
English (en)
Inventor
Fumio Takemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP16397178A priority Critical patent/JPS5592015A/ja
Publication of JPS5592015A publication Critical patent/JPS5592015A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP16397178A 1978-12-29 1978-12-29 Hermetic vessel sealing unit of piezo-vibrator Pending JPS5592015A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16397178A JPS5592015A (en) 1978-12-29 1978-12-29 Hermetic vessel sealing unit of piezo-vibrator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16397178A JPS5592015A (en) 1978-12-29 1978-12-29 Hermetic vessel sealing unit of piezo-vibrator

Publications (1)

Publication Number Publication Date
JPS5592015A true JPS5592015A (en) 1980-07-12

Family

ID=15784288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16397178A Pending JPS5592015A (en) 1978-12-29 1978-12-29 Hermetic vessel sealing unit of piezo-vibrator

Country Status (1)

Country Link
JP (1) JPS5592015A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60182813A (ja) * 1984-02-29 1985-09-18 Kinseki Kk 圧電振動子とその封止方法
JPS60182814A (ja) * 1984-02-29 1985-09-18 Kinseki Kk 圧電振動子とその封止方法
US6960870B2 (en) 1997-07-29 2005-11-01 Seiko Epson Corporation Piezo-electric resonator and manufacturing method thereof
US6976295B2 (en) 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60182813A (ja) * 1984-02-29 1985-09-18 Kinseki Kk 圧電振動子とその封止方法
JPS60182814A (ja) * 1984-02-29 1985-09-18 Kinseki Kk 圧電振動子とその封止方法
US6960870B2 (en) 1997-07-29 2005-11-01 Seiko Epson Corporation Piezo-electric resonator and manufacturing method thereof
US6976295B2 (en) 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device

Similar Documents

Publication Publication Date Title
JPS5592015A (en) Hermetic vessel sealing unit of piezo-vibrator
EP0387107A3 (en) Method and apparatus for casting a metal
JPS5787321A (en) Fusion-bonding method of skin material and foamed resin sheet
ZA85865B (en) A closure cap and method of making the same
DE3067077D1 (en) Method of fusing vanadium pentoxide powder, and furnace therefor
JPS57184574A (en) Diffusion brazing method for al or al alloy
JPS57171570A (en) Production of vessel having connecting pipe in refrigerator
SE7905726L (sv) Forfarande och anordning for upphettning av ett icke-jernmaterial med flytande brensle
JPS56119664A (en) Brazing method
JPS5771825A (en) Start-up of vitrification melting furnace
JPS6451923A (en) High-frequency welding method of resin
JPS5770081A (en) Brazing method
JPS55121385A (en) Method and device for recovering energy
JPS53146202A (en) Method and apparatus for melting and refining steel material
JPS5518506A (en) Remelting method for ductile cast iron
JPS55156019A (en) Fusion welding method of skin material to formed resin sheet
JPS5264594A (en) Torus type nuclear fusion device
JPS57115012A (en) Glass sealed quartz oscillator and its manufacture
JPS55149787A (en) Improving method in diffusion welding
Sluis High Temperature Brazing
ES293515A1 (es) Procedimiento e instalacion para la fusion y la colada, incluso de materiales de punto de fusion altisimo y7o de materiales fuertemente reactivos en un mismo horno
JPS54140240A (en) Sheath heater sealing method
JPS52120901A (en) Electroslag melting
JPS5899685A (ja) マイクロ波溶融炉の湯口内溶融物の加熱装置
JPS5321007A (en) Treating method for slag in electroslag melting