JPS5596664A - Copper alloy for lead frame of semiconductor element - Google Patents

Copper alloy for lead frame of semiconductor element

Info

Publication number
JPS5596664A
JPS5596664A JP372979A JP372979A JPS5596664A JP S5596664 A JPS5596664 A JP S5596664A JP 372979 A JP372979 A JP 372979A JP 372979 A JP372979 A JP 372979A JP S5596664 A JPS5596664 A JP S5596664A
Authority
JP
Japan
Prior art keywords
plate
lead frame
cold rolled
semiconductor element
billet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP372979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218614B2 (2
Inventor
Shoji Shiga
Norihiko Kamiyama
Hisao Orimo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP372979A priority Critical patent/JPS5596664A/ja
Publication of JPS5596664A publication Critical patent/JPS5596664A/ja
Publication of JPS6218614B2 publication Critical patent/JPS6218614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP372979A 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element Granted JPS5596664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP372979A JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP372979A JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Publications (2)

Publication Number Publication Date
JPS5596664A true JPS5596664A (en) 1980-07-23
JPS6218614B2 JPS6218614B2 (2) 1987-04-23

Family

ID=11565349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP372979A Granted JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5596664A (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748639U (2) * 1980-09-05 1982-03-18
JPS59177949A (ja) * 1983-03-29 1984-10-08 Toshiba Corp 民生用素子
JPS6232631A (ja) * 1985-08-05 1987-02-12 Hitachi Ltd 集積回路パッケージ用リード片の製法
JP2014019907A (ja) * 2012-07-18 2014-02-03 Sh Copper Products Corp 電気・電子部品用銅合金

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748639U (2) * 1980-09-05 1982-03-18
JPS59177949A (ja) * 1983-03-29 1984-10-08 Toshiba Corp 民生用素子
JPS6232631A (ja) * 1985-08-05 1987-02-12 Hitachi Ltd 集積回路パッケージ用リード片の製法
JP2014019907A (ja) * 2012-07-18 2014-02-03 Sh Copper Products Corp 電気・電子部品用銅合金

Also Published As

Publication number Publication date
JPS6218614B2 (2) 1987-04-23

Similar Documents

Publication Publication Date Title
US4466939A (en) Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
CN106591623A (zh) 一种耐高温铁青铜及其制备方法和应用
CN100425717C (zh) 引线框架用铜合金及其制造方法
CN100469923C (zh) 耐高温软化引线框架用铜合金及其制造方法
JPS5834537B2 (ja) 耐熱性の良好な高力導電用銅合金
JPS5751253A (en) Manufacture of copper alloy with high electric conductivity
JPS5596664A (en) Copper alloy for lead frame of semiconductor element
US2126827A (en) Copper-cobalt-zinc alloy
US3403997A (en) Treatment of age-hardenable coppernickel-zinc alloys and product resulting therefrom
JPS61119660A (ja) 高力高導電性銅基合金の製造方法
JPS61143566A (ja) 高力高導電性銅基合金の製造方法
CN102978431B (zh) 一种用于引线支架的铜铁合金的制造方法
CN102978429B (zh) 一种制造支架的铜合金
US3464865A (en) Process for treating copper base alloys
CN102978430B (zh) 一种引线支架的制造方法
JPS5924177B2 (ja) 角形ヒステリシス磁性合金
JPS5768061A (en) Lead material for semiconductor device
JPS61143564A (ja) 高力高導電性銅基合金の製造方法
JPS63293147A (ja) 高強度リ−ドフレ−ム用鉄銅クロム合金薄帯の製造方法
JPS6142772B2 (2)
JPH0356294B2 (2)
JPS5939492B2 (ja) 耐軟化性導電用高力銅合金
JPS5698440A (en) Copper alloy for lead wire having magnetism
JPH0243811B2 (2)
CN102978432B (zh) 一种用于半导体器件的引线支架