JPS5598826A - Heat treatment jig for semiconductor wafer - Google Patents
Heat treatment jig for semiconductor waferInfo
- Publication number
- JPS5598826A JPS5598826A JP695879A JP695879A JPS5598826A JP S5598826 A JPS5598826 A JP S5598826A JP 695879 A JP695879 A JP 695879A JP 695879 A JP695879 A JP 695879A JP S5598826 A JPS5598826 A JP S5598826A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- heat treatment
- grooves
- jig
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 9
- 238000009792 diffusion process Methods 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 2
- 230000003647 oxidation Effects 0.000 abstract 2
- 238000007254 oxidation reaction Methods 0.000 abstract 2
- 239000010453 quartz Substances 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
Abstract
PURPOSE: To attain a uniform layer resistance or oxide film thickness, by providing a wafer heat treatment jig for heat treatment including diffusion and oxidation, with side wall grooves for setting up numerous wafers at a spacing and by causing the grooves to extend obliquely at 5W50° to the flowing direction of a fluid.
CONSTITUTION: Numerous semiconductor wafers 8 are set up at a spacing on a wafer heat treatment jig 1. The jig is inserted into a furnace core pipe 2. A prescribed fluid is caused to flow from a nozzle 3 provided on one end of the pipe 2 to raise the temperature of the wafers for diffusion, oxidation or the like. Grooves 5, in which the edges of the wafers 8 are fitted, are provided on two parallel wafer support bars 4 mounted on the quartz jig. Reinforcing bars 6 are secured on the outsides of the support bars 4. The grooves 5 extend not perpendicularly to the flowing direction 7 of gas but obliquely at 5W50° to the direction 7. As a result, the flow of the gas is changed and revolved by the wafers 8 and the quantity of the gas which comes into contact with the surface of each wafer is made kept constant.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP695879A JPS5598826A (en) | 1979-01-23 | 1979-01-23 | Heat treatment jig for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP695879A JPS5598826A (en) | 1979-01-23 | 1979-01-23 | Heat treatment jig for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5598826A true JPS5598826A (en) | 1980-07-28 |
Family
ID=11652723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP695879A Pending JPS5598826A (en) | 1979-01-23 | 1979-01-23 | Heat treatment jig for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5598826A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4355974A (en) * | 1980-11-24 | 1982-10-26 | Asq Boats, Inc. | Wafer boat |
| JPH01199424A (en) * | 1987-10-08 | 1989-08-10 | Tadahiro Omi | Thin film depositing process and device thereof |
| US5582649A (en) * | 1996-02-29 | 1996-12-10 | The United States Of America As Represented By The Secretary Of The Air Force | Wafer transfer apparatus for use in a film deposition furnace |
-
1979
- 1979-01-23 JP JP695879A patent/JPS5598826A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4355974A (en) * | 1980-11-24 | 1982-10-26 | Asq Boats, Inc. | Wafer boat |
| JPH01199424A (en) * | 1987-10-08 | 1989-08-10 | Tadahiro Omi | Thin film depositing process and device thereof |
| US5582649A (en) * | 1996-02-29 | 1996-12-10 | The United States Of America As Represented By The Secretary Of The Air Force | Wafer transfer apparatus for use in a film deposition furnace |
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