JPS5599754A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5599754A
JPS5599754A JP709479A JP709479A JPS5599754A JP S5599754 A JPS5599754 A JP S5599754A JP 709479 A JP709479 A JP 709479A JP 709479 A JP709479 A JP 709479A JP S5599754 A JPS5599754 A JP S5599754A
Authority
JP
Japan
Prior art keywords
wire
fastening piece
circuit element
lead frame
deformed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP709479A
Other languages
Japanese (ja)
Inventor
Minoru Imai
Yoshiaki Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP709479A priority Critical patent/JPS5599754A/en
Publication of JPS5599754A publication Critical patent/JPS5599754A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To avoid short circuit by providing a groove on a fastening piece lying immediately below a wire connecting a circuit element and a lead and preventing the wire from coming into contact with the fastening piece even when it is deformed. CONSTITUTION:Circuit element 15 is fixed to fastening piece 10, and a plurality of leads 12 and circuit element 15 are connected by wire 16. Fastening piece 10 is provided with groove 14 on its part lying immediately below wire 16 so that wire 16 is prevented from coming into contact with fastening piece 10 even if wire 16 is deformed.
JP709479A 1979-01-26 1979-01-26 Lead frame Pending JPS5599754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP709479A JPS5599754A (en) 1979-01-26 1979-01-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP709479A JPS5599754A (en) 1979-01-26 1979-01-26 Lead frame

Publications (1)

Publication Number Publication Date
JPS5599754A true JPS5599754A (en) 1980-07-30

Family

ID=11656484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP709479A Pending JPS5599754A (en) 1979-01-26 1979-01-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS5599754A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175130U (en) * 1984-10-22 1986-05-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175130U (en) * 1984-10-22 1986-05-21

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