JPS5615535A - Ion source chamber - Google Patents
Ion source chamberInfo
- Publication number
- JPS5615535A JPS5615535A JP9119479A JP9119479A JPS5615535A JP S5615535 A JPS5615535 A JP S5615535A JP 9119479 A JP9119479 A JP 9119479A JP 9119479 A JP9119479 A JP 9119479A JP S5615535 A JPS5615535 A JP S5615535A
- Authority
- JP
- Japan
- Prior art keywords
- filament
- chamber
- gas
- introduction holes
- uniformly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/022—Details
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
PURPOSE:To lengthen the longevity of filament by providing a plurality of gas introduction holes uniformly distributed and single gas exhausting and ion beam- fetching hole in a chamber in which a barlike filament is incorporated. CONSTITUTION:The chamber 11 is housed with the barlike filament 12 connected to the power source 15', and also to the arc power source 16 between the filament 12 and the chamber 11. Also one side of the chamber 11 is provided uniformly with the plural gas introduction holes 13 along the filament 12, and the other side is provided with the single gas-exhausting and ion beam-fetching hole 14. Thus, gas is introduced into the introduction holes 13 uniformly provided and then flowed in an uniformly distributed manner throughout the whole length of the filament 12, so that the degree of the spattering of the filament 12 by means of ion is made uniform and the life of the filament can therefore be lengthened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9119479A JPS5615535A (en) | 1979-07-18 | 1979-07-18 | Ion source chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9119479A JPS5615535A (en) | 1979-07-18 | 1979-07-18 | Ion source chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5615535A true JPS5615535A (en) | 1981-02-14 |
Family
ID=14019628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9119479A Pending JPS5615535A (en) | 1979-07-18 | 1979-07-18 | Ion source chamber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5615535A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6424338A (en) * | 1987-07-17 | 1989-01-26 | Nissin Electric Co Ltd | Ion source |
| US4915979A (en) * | 1988-07-05 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor wafer treating device utilizing ECR plasma |
| KR20030097284A (en) * | 2002-06-20 | 2003-12-31 | 삼성전자주식회사 | Ion source for ion implantation equipment |
| KR100690447B1 (en) * | 2005-07-28 | 2007-03-09 | (주)인텍 | Ion Generator and Thin Film Deposition Equipment Using the Same |
-
1979
- 1979-07-18 JP JP9119479A patent/JPS5615535A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6424338A (en) * | 1987-07-17 | 1989-01-26 | Nissin Electric Co Ltd | Ion source |
| US4915979A (en) * | 1988-07-05 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor wafer treating device utilizing ECR plasma |
| KR20030097284A (en) * | 2002-06-20 | 2003-12-31 | 삼성전자주식회사 | Ion source for ion implantation equipment |
| KR100690447B1 (en) * | 2005-07-28 | 2007-03-09 | (주)인텍 | Ion Generator and Thin Film Deposition Equipment Using the Same |
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