JPS607743A - Resin sealed semiconductor device - Google Patents

Abstract

PURPOSE:To check the drop of mounting density and disarrangement in regard to mounting of a resin sealed semiconductor device by a method wherein the resin sealing region of the molded IC is enlarged up to the bending positions of outside leads. CONSTITUTION:The part between the outside lead bending position and the resin sealing edge existing in a usual DIP molded IC is excluded, and the edge part of a resin sealing region 21 is extended up to the outside lead bending positions 22. Accordingly, lengths of sealed resin parts 27, intervals between the leads 27 and an island 28, and the margins of sizes of the island 28 and a pellet 26 can be fixed to the necessary values, and moreover mounting of the more large pellet can be attained, and to extend an interval A between the lead bending positions according to the increase of pellet size as usual is not necessary, the drop of mounting density can be checked, and moreover disarrangement in regard to mounting such as a product group having the same faculty are loaded on molded ICs having different sizes A can be also avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin-sealed semiconductor device (hereinafter referred to as a molded IC) and a mold that is improved so as to be able to mount a semiconductor element having a particularly large area (hereinafter referred to as a pellet). IC
Regarding the structure of

In a conventional molded IC, for example, taking a dual inline molded IC (hereinafter referred to as a DIP molded IC) as an example, as shown in FIG. located on the inside, that is, the external lead bending position 12 and the resin sealing area end 13
There was a space 15 between them.

In such a conventional DIP molded IC, the size of the pellet 16 that can be mounted on the IC is greatly restricted, and if a larger pellet is to be mounted, the distance A between the external lead bending positions 12 and 12' may be too small. It has to be mounted on a wide DIP molded IC, and as a result, the IC
J
This caused great confusion in IC mounting.

For example, if we use a so-called 300 mil type DIP molded IC with dimensions of 300 mils (7,62 mm), and the space 15 is approximately 0.6 mm, the maximum dimensions of the bellet 16 that can be mounted are: I'll think about it.

The lead portion 17 sealed in the resin sealing area requires a length to prevent the lead from coming out of the sealing area, and although improvements have been made to the lead shape and resin material. , a minimum of about 0.9 mrx is required. Next, the lead part 17
The distance between the lead frame and the pallet mounting part 18 (hereinafter referred to as the island part) is determined by the lead frame manufacturing process.
For assembly, if the thickness of the lead frame is 0.25 mrn, a minimum of about 0.5 mm is required. If the bullet 16 is to be stably mounted on the island portion 18, the island portion size needs to be approximately 0.6 mrx larger than the bullet size.

Therefore, in the above example, the maximum size of the pellet that can be mounted is (7.62mm) - (2X0.6mg+2X0.9m@
+2X0.5mm+0.6mm), which is about 3mjE.

If you are trying to install a larger pellet than this,
For example, it has become necessary to mount it on a 400 mil DIP molded IC, etc., which has large dimensions.

Therefore, an object of the present invention is to eliminate such conventional drawbacks,
The purpose of the present invention is to mount a larger pellet on a molded IC of the same size, and to achieve this purpose, the present invention is characterized in that the resin sealing area in the molded IC is expanded to the position where the external leads are bent. That is.

According to the present invention, taking a DIP molded IC as an example, as shown in FIG. , set the length of the lead part 27 sealed in the resin sealing area, the distance between the lead part 27 and the pellet part 28, and the dimensional margin of the pellet mounting part 28 and the pellet 260 to the required values, and A large bellet, for example the 3 mentioned above.
In the case of a 00 mil DIP molded IC, it is possible to mount a pellet of approximately 4 mx or more.

The present invention produces similar effects not only in DIP mold ICs but also in flat mold ICs and quadruple in-line mold ICs.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the structure of a conventional DIP mold IC, and FIG. 2 is a DIP mold IC according to an embodiment of the present invention.
FIG. In addition, in the figure, 11.21...resin sealing area,
12.22-... External lead bending position, 13-...
...Resin sealing area end, 14.24...External lead, 15...Space (external lead bending position and sealing termination interval), 16.26... ... Pellet), 17.27 ... - ... Resin-sealed lead part, 18.28 ... Island part. /l-1/' Agent Patent Attorney Susumu Uchihara:,7, -'n Figure 2

Claims (1)

[Claims] 1. A resin-sealed semiconductor device, characterized in that a resin-sealed area of the device is expanded to include an external lead bending position.