JPS564648A - Production of epoxy resin composition - Google Patents
Production of epoxy resin compositionInfo
- Publication number
- JPS564648A JPS564648A JP7933579A JP7933579A JPS564648A JP S564648 A JPS564648 A JP S564648A JP 7933579 A JP7933579 A JP 7933579A JP 7933579 A JP7933579 A JP 7933579A JP S564648 A JPS564648 A JP S564648A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- complex
- reaction product
- acid
- vinylphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000002253 acid Substances 0.000 abstract 3
- 239000007795 chemical reaction product Substances 0.000 abstract 3
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 abstract 2
- 239000002841 Lewis acid Substances 0.000 abstract 2
- 150000002460 imidazoles Chemical class 0.000 abstract 2
- 150000007517 lewis acids Chemical class 0.000 abstract 2
- 239000000047 product Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To obtain an epoxy resin which has a moderate curing rate and provides cured products having excellent heat resistance, by reacting an epoxy resin with a complex of an imidazole derivative and a Lewis acid or a Brϕnsted acid, and mixing the reaction product with poly-p-vinylphenol.
CONSTITUTION: A complex of an imidazole derivative and at least one acid selected from a Lewis acid and a Brϕnsted acid is prepared. Five hundredths to five pts.wt. of said complex is mixed with 100pts.wt. of an epoxy resin and the mixture is heated and reacted. Then, the reaction product is mixed with poly-p-vinylphenol or a halogenated derivative thereof so that pref. 0.5W2.0 hydroxyl eq. of the phenol is present per epoxy eq. of the reaction product. With respect to the amount of the complex added, amounts smaller than the above range can not provide cured products having desirable heat resistance, whereas amounts larger than the above range reduce moldability-improving effect and merely provide rapid curing compositions.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933579A JPS564648A (en) | 1979-06-22 | 1979-06-22 | Production of epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933579A JPS564648A (en) | 1979-06-22 | 1979-06-22 | Production of epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS564648A true JPS564648A (en) | 1981-01-19 |
Family
ID=13687018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7933579A Pending JPS564648A (en) | 1979-06-22 | 1979-06-22 | Production of epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS564648A (en) |
-
1979
- 1979-06-22 JP JP7933579A patent/JPS564648A/en active Pending
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