JPS5687353A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS5687353A JPS5687353A JP16427479A JP16427479A JPS5687353A JP S5687353 A JPS5687353 A JP S5687353A JP 16427479 A JP16427479 A JP 16427479A JP 16427479 A JP16427479 A JP 16427479A JP S5687353 A JPS5687353 A JP S5687353A
- Authority
- JP
- Japan
- Prior art keywords
- film
- opening
- resistance element
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To obtain the semiconductor device having a high integration when a resistance element is to be provided on the semiconductor substrate by a method wherein a plasma vapor phase growth layer of S nitride film, amorphous Si film, etc., is used as a resistor forming material. CONSTITUTION:For example, a field oxide film 102, a gate oxide film 104, source, drain 103 are formed on the p type Si substrate 101. An opening is provided in the gate electrode 105 being connected with the source, drain 103 through buried opening parts. The resistance element 106 is provided in the opening using the plasma vapor phase growth layer of Si nitride film, amorphous Si film, etc., and is connected with an Al wiring 107. Accordingly the occupying area of the resistance element becomes the same grade with the area of the opening part, and the high integration of the semiconductor device can be attempted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16427479A JPS5687353A (en) | 1979-12-18 | 1979-12-18 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16427479A JPS5687353A (en) | 1979-12-18 | 1979-12-18 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5687353A true JPS5687353A (en) | 1981-07-15 |
Family
ID=15789964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16427479A Pending JPS5687353A (en) | 1979-12-18 | 1979-12-18 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5687353A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4951118A (en) * | 1985-10-07 | 1990-08-21 | Nec Corporation | Semiconductor device having resistor structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4957780A (en) * | 1972-10-02 | 1974-06-05 | ||
| JPS52115785A (en) * | 1976-01-22 | 1977-09-28 | Western Electric Co | Process for coating substrate |
-
1979
- 1979-12-18 JP JP16427479A patent/JPS5687353A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4957780A (en) * | 1972-10-02 | 1974-06-05 | ||
| JPS52115785A (en) * | 1976-01-22 | 1977-09-28 | Western Electric Co | Process for coating substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4951118A (en) * | 1985-10-07 | 1990-08-21 | Nec Corporation | Semiconductor device having resistor structure |
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