JPS5693346A - Semiconductor device container - Google Patents
Semiconductor device containerInfo
- Publication number
- JPS5693346A JPS5693346A JP17004979A JP17004979A JPS5693346A JP S5693346 A JPS5693346 A JP S5693346A JP 17004979 A JP17004979 A JP 17004979A JP 17004979 A JP17004979 A JP 17004979A JP S5693346 A JPS5693346 A JP S5693346A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- heated
- sapphire plate
- covered
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
Landscapes
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To obtain the container in a low price and rich in massproductivity by a method wherein a light-penetrated window covered with a sapphire plate is formed in a cap of an Fe-Ni-Co alloy of Fe-Ni alloy. CONSTITUTION:The Fe-Ni-Co alloy kovar is used for the cap member with the window, acid-pickled, heated in H2 and then covered with a film oxide. Then, a sapphire adhered part is coated with covar glass and heated to form a glass layer 3 of temporary sintering. The sapphire plate is cleansed and activated on the surface in prior and applied a heat treatment in an oxidized atmosphere to get to fit well to the glass. The window 2 is fixedly attached to the cap 1 when covered with the sapphire plate 4 on which a weight 5 is mounted and heated in N2. The cap is welded into a stem on which a photosemiconductor element is mounted and sealed in airlight. In this construction, since the covar is used, the sapphire plate can be fixed in O2 or N2 atmosphere, being bearable against thermal shocks at +200- -55 deg.C and in addition, being low in the cost price also because Ti or the like is not used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54170049A JPS5814070B2 (en) | 1979-12-26 | 1979-12-26 | semiconductor device container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54170049A JPS5814070B2 (en) | 1979-12-26 | 1979-12-26 | semiconductor device container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5693346A true JPS5693346A (en) | 1981-07-28 |
| JPS5814070B2 JPS5814070B2 (en) | 1983-03-17 |
Family
ID=15897662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54170049A Expired JPS5814070B2 (en) | 1979-12-26 | 1979-12-26 | semiconductor device container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814070B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849658U (en) * | 1981-09-29 | 1983-04-04 | 岐阜プラスチック工業株式会社 | bucket |
| JPS6289146U (en) * | 1985-11-22 | 1987-06-08 | ||
| US4710797A (en) * | 1983-03-14 | 1987-12-01 | Oki Electric Industry Co., Ltd. | Erasable and programable read only memory devices |
| JPS6331140A (en) * | 1986-07-25 | 1988-02-09 | Toshiba Components Kk | Manufacture of package with window for semiconductor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55154753A (en) * | 1979-05-21 | 1980-12-02 | Toshiba Corp | Package for semiconductor device |
-
1979
- 1979-12-26 JP JP54170049A patent/JPS5814070B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55154753A (en) * | 1979-05-21 | 1980-12-02 | Toshiba Corp | Package for semiconductor device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849658U (en) * | 1981-09-29 | 1983-04-04 | 岐阜プラスチック工業株式会社 | bucket |
| US4710797A (en) * | 1983-03-14 | 1987-12-01 | Oki Electric Industry Co., Ltd. | Erasable and programable read only memory devices |
| JPS6289146U (en) * | 1985-11-22 | 1987-06-08 | ||
| JPS6331140A (en) * | 1986-07-25 | 1988-02-09 | Toshiba Components Kk | Manufacture of package with window for semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5814070B2 (en) | 1983-03-17 |
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