JPS5694764A - Protection method of semiconductor device - Google Patents

Protection method of semiconductor device

Info

Publication number
JPS5694764A
JPS5694764A JP17098479A JP17098479A JPS5694764A JP S5694764 A JPS5694764 A JP S5694764A JP 17098479 A JP17098479 A JP 17098479A JP 17098479 A JP17098479 A JP 17098479A JP S5694764 A JPS5694764 A JP S5694764A
Authority
JP
Japan
Prior art keywords
semiconductor element
lead
semiconductor device
thereafter
puncture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17098479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250980B2 (mo
Inventor
Rikuro Sono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17098479A priority Critical patent/JPS5694764A/ja
Publication of JPS5694764A publication Critical patent/JPS5694764A/ja
Publication of JPS6250980B2 publication Critical patent/JPS6250980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP17098479A 1979-12-28 1979-12-28 Protection method of semiconductor device Granted JPS5694764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17098479A JPS5694764A (en) 1979-12-28 1979-12-28 Protection method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17098479A JPS5694764A (en) 1979-12-28 1979-12-28 Protection method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5694764A true JPS5694764A (en) 1981-07-31
JPS6250980B2 JPS6250980B2 (mo) 1987-10-28

Family

ID=15914967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17098479A Granted JPS5694764A (en) 1979-12-28 1979-12-28 Protection method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5694764A (mo)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5983189A (ja) * 1982-11-04 1984-05-14 セイコーエプソン株式会社 液晶電気光学装置の製造方法
JPS6177345A (ja) * 1984-09-21 1986-04-19 Fujitsu Ltd 半導体装置の製造方法
DE102004064150B4 (de) * 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642213U (ja) * 1992-11-11 1994-06-03 大日本インキ化学工業株式会社 配送伝票

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50105545U (mo) * 1974-02-04 1975-08-30
JPS576255A (en) * 1980-06-12 1982-01-13 Kikai Syst Shinko Kyokai Solar heat collector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50105545U (mo) * 1974-02-04 1975-08-30
JPS576255A (en) * 1980-06-12 1982-01-13 Kikai Syst Shinko Kyokai Solar heat collector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5983189A (ja) * 1982-11-04 1984-05-14 セイコーエプソン株式会社 液晶電気光学装置の製造方法
JPS6177345A (ja) * 1984-09-21 1986-04-19 Fujitsu Ltd 半導体装置の製造方法
DE102004064150B4 (de) * 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz

Also Published As

Publication number Publication date
JPS6250980B2 (mo) 1987-10-28

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