JPS57100751A - Metallic container for semiconductor device - Google Patents

Metallic container for semiconductor device

Info

Publication number
JPS57100751A
JPS57100751A JP55177901A JP17790180A JPS57100751A JP S57100751 A JPS57100751 A JP S57100751A JP 55177901 A JP55177901 A JP 55177901A JP 17790180 A JP17790180 A JP 17790180A JP S57100751 A JPS57100751 A JP S57100751A
Authority
JP
Japan
Prior art keywords
projection
metallic
grounding
base
metallic container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55177901A
Other languages
Japanese (ja)
Inventor
Taichiro Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55177901A priority Critical patent/JPS57100751A/en
Publication of JPS57100751A publication Critical patent/JPS57100751A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the parasitic oscillation by providing at least one grounding projection separately from a direction indicating projection at either one of a metallic base and a metallic container. CONSTITUTION:One or more of grounding projection 16 is provided separately from a metallic base having leads 3-6 electrically insulated with insulator with a flat part carrying a semiconductor element and a direction indicating projection 7 of either one metallic cover member 1 adhered to the base. In this manner, the inductance of the lead can be eliminated merely by soldering to the grounding wire of the printed circuit board, thereby preventing the parasitic oscillation.
JP55177901A 1980-12-16 1980-12-16 Metallic container for semiconductor device Pending JPS57100751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55177901A JPS57100751A (en) 1980-12-16 1980-12-16 Metallic container for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55177901A JPS57100751A (en) 1980-12-16 1980-12-16 Metallic container for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57100751A true JPS57100751A (en) 1982-06-23

Family

ID=16039036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55177901A Pending JPS57100751A (en) 1980-12-16 1980-12-16 Metallic container for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57100751A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246416U (en) * 1988-09-22 1990-03-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246416U (en) * 1988-09-22 1990-03-29

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