JPS57112055A - Integrated circuit package - Google Patents

Integrated circuit package

Info

Publication number
JPS57112055A
JPS57112055A JP55187283A JP18728380A JPS57112055A JP S57112055 A JPS57112055 A JP S57112055A JP 55187283 A JP55187283 A JP 55187283A JP 18728380 A JP18728380 A JP 18728380A JP S57112055 A JPS57112055 A JP S57112055A
Authority
JP
Japan
Prior art keywords
chip
concave
heat
cap
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55187283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634714B2 (de
Inventor
Tetsushi Wakabayashi
Kiyoshi Muratake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55187283A priority Critical patent/JPS57112055A/ja
Publication of JPS57112055A publication Critical patent/JPS57112055A/ja
Publication of JPS634714B2 publication Critical patent/JPS634714B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55187283A 1980-12-29 1980-12-29 Integrated circuit package Granted JPS57112055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55187283A JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55187283A JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Publications (2)

Publication Number Publication Date
JPS57112055A true JPS57112055A (en) 1982-07-12
JPS634714B2 JPS634714B2 (de) 1988-01-30

Family

ID=16203279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55187283A Granted JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Country Status (1)

Country Link
JP (1) JPS57112055A (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (ja) * 1985-11-13 1987-05-26 Nec Corp 集積回路の放熱構造
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
JPH05144959A (ja) * 1991-11-18 1993-06-11 Fujitsu Ltd 半導体装置
JPH08124633A (ja) * 1994-10-24 1996-05-17 Nec Corp コネクタ
EP0883175A3 (de) * 1997-06-03 1999-06-09 Lsi Logic Corporation Kühler höherer Leistung für Flipchippackungen
JP2004140289A (ja) * 2002-10-21 2004-05-13 Funai Electric Co Ltd 電子部品の放熱構造およびこれを備えたディスクドライブ装置
JP2010012850A (ja) * 2008-07-02 2010-01-21 Nsk Ltd 電動パワーステアリング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836595A (de) * 1971-09-13 1973-05-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836595A (de) * 1971-09-13 1973-05-30

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (ja) * 1985-11-13 1987-05-26 Nec Corp 集積回路の放熱構造
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
JPH05144959A (ja) * 1991-11-18 1993-06-11 Fujitsu Ltd 半導体装置
JPH08124633A (ja) * 1994-10-24 1996-05-17 Nec Corp コネクタ
EP0883175A3 (de) * 1997-06-03 1999-06-09 Lsi Logic Corporation Kühler höherer Leistung für Flipchippackungen
JP2004140289A (ja) * 2002-10-21 2004-05-13 Funai Electric Co Ltd 電子部品の放熱構造およびこれを備えたディスクドライブ装置
JP2010012850A (ja) * 2008-07-02 2010-01-21 Nsk Ltd 電動パワーステアリング装置

Also Published As

Publication number Publication date
JPS634714B2 (de) 1988-01-30

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