JPS57145351A - Lead frame for semiconductor - Google Patents

Lead frame for semiconductor

Info

Publication number
JPS57145351A
JPS57145351A JP56030996A JP3099681A JPS57145351A JP S57145351 A JPS57145351 A JP S57145351A JP 56030996 A JP56030996 A JP 56030996A JP 3099681 A JP3099681 A JP 3099681A JP S57145351 A JPS57145351 A JP S57145351A
Authority
JP
Japan
Prior art keywords
alloy
wire
lead frame
semiconductor
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56030996A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244816B2 (it
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP56030996A priority Critical patent/JPS57145351A/ja
Publication of JPS57145351A publication Critical patent/JPS57145351A/ja
Publication of JPS6244816B2 publication Critical patent/JPS6244816B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP56030996A 1981-03-04 1981-03-04 Lead frame for semiconductor Granted JPS57145351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56030996A JPS57145351A (en) 1981-03-04 1981-03-04 Lead frame for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56030996A JPS57145351A (en) 1981-03-04 1981-03-04 Lead frame for semiconductor

Publications (2)

Publication Number Publication Date
JPS57145351A true JPS57145351A (en) 1982-09-08
JPS6244816B2 JPS6244816B2 (it) 1987-09-22

Family

ID=12319202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56030996A Granted JPS57145351A (en) 1981-03-04 1981-03-04 Lead frame for semiconductor

Country Status (1)

Country Link
JP (1) JPS57145351A (it)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192057A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor device
JPS6010796A (ja) * 1983-06-30 1985-01-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 配線構造体
JPS6362259A (ja) * 1986-09-02 1988-03-18 Nec Corp 半導体装置用リ−ドフレ−ム
JP7096955B1 (ja) * 2020-12-28 2022-07-06 松田産業株式会社 Ｎｉ電解めっき皮膜を備えるめっき構造体及び該めっき構造体を含むリードフレーム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108757A (en) * 1979-02-15 1980-08-21 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108757A (en) * 1979-02-15 1980-08-21 Toshiba Corp Semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192057A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor device
JPS6010796A (ja) * 1983-06-30 1985-01-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 配線構造体
JPS6362259A (ja) * 1986-09-02 1988-03-18 Nec Corp 半導体装置用リ−ドフレ−ム
JP7096955B1 (ja) * 2020-12-28 2022-07-06 松田産業株式会社 Ｎｉ電解めっき皮膜を備えるめっき構造体及び該めっき構造体を含むリードフレーム
WO2022145290A1 (ja) * 2020-12-28 2022-07-07 松田産業株式会社 Ｎｉ電解めっき皮膜を備えるめっき構造体及び該めっき構造体を含むリードフレーム
JP2022103538A (ja) * 2020-12-28 2022-07-08 松田産業株式会社 ニッケル電解めっき皮膜及びめっき構造体
CN116324002A (zh) * 2020-12-28 2023-06-23 松田产业株式会社 具有Ni电镀膜的镀敷结构体和包含该镀敷结构体的引线框架

Also Published As

Publication number Publication date
JPS6244816B2 (it) 1987-09-22

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