JPS57160135A - Automatic bonding method for inner lead - Google Patents

Automatic bonding method for inner lead

Info

Publication number: JPS57160135A
Authority: JP; Japan
Prior art keywords: inner lead; bonding; pitch; tape; feeder
Prior art date: 1981-03-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP56044736A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6227735B2 (2

Inventor

Seiichi Chiba

Akihiro Nishimura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shinkawa Ltd

Original Assignee

Shinkawa Ltd

Shinkawa Seisakusho Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-03-28

Filing date

1981-03-28

Publication date

1982-10-02

1981-03-28 Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd

1981-03-28 Priority to JP56044736A priority Critical patent/JPS57160135A/ja

1982-10-02 Publication of JPS57160135A publication Critical patent/JPS57160135A/ja

1987-06-16 Publication of JPS6227735B2 publication Critical patent/JPS6227735B2/ja

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/077—Connecting of TAB connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

Wire Bonding (AREA)

JP56044736A 1981-03-28 1981-03-28 Automatic bonding method for inner lead Granted JPS57160135A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP56044736A JPS57160135A (en)	1981-03-28	1981-03-28	Automatic bonding method for inner lead

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP56044736A JPS57160135A (en)	1981-03-28	1981-03-28	Automatic bonding method for inner lead

Publications (2)

Publication Number	Publication Date
JPS57160135A true JPS57160135A (en)	1982-10-02
JPS6227735B2 JPS6227735B2 (2)	1987-06-16

Family

ID=12699726

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP56044736A Granted JPS57160135A (en)	1981-03-28	1981-03-28	Automatic bonding method for inner lead

Country Status (1)

Country	Link
JP (1)	JPS57160135A (2)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59175132A (ja) *	1983-03-23	1984-10-03	Nec Corp	テ−プキヤリア方式による半導体装置の製造方法
JPS63173670A (ja) *	1987-01-13	1988-07-18	Alps Electric Co Ltd	光書き込みヘッド
JPH01230240A (ja) *	1987-06-10	1989-09-13	Hitachi Ltd	ボンディング方法及び装置
US5059559A (en) *	1987-11-02	1991-10-22	Hitachi, Ltd.	Method of aligning and bonding tab inner leads
JPH0520327U (ja) *	1991-08-23	1993-03-12	安藤電気株式会社	Ｔａｂテープと電極の位置合わせ機構

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4910677A (2) *	1972-05-24	1974-01-30
JPS5214148A (en) *	1975-06-24	1977-02-02	Hitachi Ltd	Operation method of the guide vane of the water wheel having the high head
JPS549583A (en) *	1977-06-24	1979-01-24	Shinkawa Seisakusho Kk	Device for positioning pellets
JPS54134974A (en) *	1978-04-12	1979-10-19	Hitachi Ltd	Method and device for bonding on tape carrier system

1981
- 1981-03-28 JP JP56044736A patent/JPS57160135A/ja active Granted

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4910677A (2) *	1972-05-24	1974-01-30
JPS5214148A (en) *	1975-06-24	1977-02-02	Hitachi Ltd	Operation method of the guide vane of the water wheel having the high head
JPS549583A (en) *	1977-06-24	1979-01-24	Shinkawa Seisakusho Kk	Device for positioning pellets
JPS54134974A (en) *	1978-04-12	1979-10-19	Hitachi Ltd	Method and device for bonding on tape carrier system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59175132A (ja) *	1983-03-23	1984-10-03	Nec Corp	テ−プキヤリア方式による半導体装置の製造方法
JPS63173670A (ja) *	1987-01-13	1988-07-18	Alps Electric Co Ltd	光書き込みヘッド
JPH01230240A (ja) *	1987-06-10	1989-09-13	Hitachi Ltd	ボンディング方法及び装置
US5059559A (en) *	1987-11-02	1991-10-22	Hitachi, Ltd.	Method of aligning and bonding tab inner leads
JPH0520327U (ja) *	1991-08-23	1993-03-12	安藤電気株式会社	Ｔａｂテープと電極の位置合わせ機構

Also Published As

Publication number	Publication date
JPS6227735B2 (2)	1987-06-16

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