JPS5718366A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5718366A JPS5718366A JP9352780A JP9352780A JPS5718366A JP S5718366 A JPS5718366 A JP S5718366A JP 9352780 A JP9352780 A JP 9352780A JP 9352780 A JP9352780 A JP 9352780A JP S5718366 A JPS5718366 A JP S5718366A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- silicon
- semiconductor device
- integration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To enable the integration of a semiconductor device by covering source and drain electrode contacting windows formed in advance by a self-alignment system with nitrided silicon film by an ion injection and a heat treatment, forming an insulating film on the side surface of a silicon gate electrode and removing the nitrided silicon film. CONSTITUTION:A field insulating film 2 and an active region opening 24 are formed by a selective oxide forming method on a one conductive semiconductor substrate, a silicon insulating film formed then is patterned, and a gate insulated film 3, a silicon gate electrode 4 and a protective insulating film 5 are sequentially formed in the opening 2A. Subsequently, nitrogen ions are injected, a heat treatment is then conducted, and nitrided silicon films 6 covering at least source and drain electrode contacting windows are formed. Then, an insulating film 7 is formed on the side surface of the electrode 4, thereafter the film 6 is removed, and the window is exposed. The electrode contacting window is thus formed by a self-alignment system, and the integration of the semiconductor device can be performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9352780A JPS5718366A (en) | 1980-07-09 | 1980-07-09 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9352780A JPS5718366A (en) | 1980-07-09 | 1980-07-09 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5718366A true JPS5718366A (en) | 1982-01-30 |
Family
ID=14084776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9352780A Pending JPS5718366A (en) | 1980-07-09 | 1980-07-09 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5718366A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3140654A1 (en) * | 1980-10-17 | 1982-06-24 | Nippon Columbia K.K., Tokyo | CIRCUIT FOR ELIMINATION OF DISTORTION |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5292486A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Manufacture of mis-type semiconductor device |
-
1980
- 1980-07-09 JP JP9352780A patent/JPS5718366A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5292486A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Manufacture of mis-type semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3140654A1 (en) * | 1980-10-17 | 1982-06-24 | Nippon Columbia K.K., Tokyo | CIRCUIT FOR ELIMINATION OF DISTORTION |
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