JPS57188858A - Plastic molded type semiconductor device - Google Patents

Plastic molded type semiconductor device

Info

Publication number
JPS57188858A
JPS57188858A JP56075444A JP7544481A JPS57188858A JP S57188858 A JPS57188858 A JP S57188858A JP 56075444 A JP56075444 A JP 56075444A JP 7544481 A JP7544481 A JP 7544481A JP S57188858 A JPS57188858 A JP S57188858A
Authority
JP
Japan
Prior art keywords
type semiconductor
thin strips
resin molded
plastic molded
taking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56075444A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227750B2 (2
Inventor
Masami Yokozawa
Isao Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP56075444A priority Critical patent/JPS57188858A/ja
Priority to US06/378,435 priority patent/US4503452A/en
Priority to CA000403080A priority patent/CA1180469A/en
Priority to EP82104364A priority patent/EP0066188B1/en
Priority to DE8282104364T priority patent/DE3267996D1/de
Publication of JPS57188858A publication Critical patent/JPS57188858A/ja
Publication of JPS6227750B2 publication Critical patent/JPS6227750B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP56075444A 1981-05-18 1981-05-18 Plastic molded type semiconductor device Granted JPS57188858A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP56075444A JPS57188858A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device
US06/378,435 US4503452A (en) 1981-05-18 1982-05-14 Plastic encapsulated semiconductor device and method for manufacturing the same
CA000403080A CA1180469A (en) 1981-05-18 1982-05-17 Plastic encapsulated semiconductor device and method for manufacturing the same
EP82104364A EP0066188B1 (en) 1981-05-18 1982-05-18 Plastic encapsulated semiconductor device and method for manufacturing the same
DE8282104364T DE3267996D1 (en) 1981-05-18 1982-05-18 Plastic encapsulated semiconductor device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56075444A JPS57188858A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device

Publications (2)

Publication Number Publication Date
JPS57188858A true JPS57188858A (en) 1982-11-19
JPS6227750B2 JPS6227750B2 (2) 1987-06-16

Family

ID=13576421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56075444A Granted JPS57188858A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device

Country Status (5)

Country Link
US (1) US4503452A (2)
EP (1) EP0066188B1 (2)
JP (1) JPS57188858A (2)
CA (1) CA1180469A (2)
DE (1) DE3267996D1 (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60128645A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
JPS60229352A (ja) * 1984-04-26 1985-11-14 Fuji Electric Co Ltd 樹脂封止形半導体装置および樹脂封止方法
JPS6415958A (en) * 1987-07-10 1989-01-19 Hitachi Ltd Resin-encapsulated semiconductor device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130449A (ja) * 1983-01-17 1984-07-27 Nec Corp 絶縁型半導体素子用リードフレーム
JPS59135753A (ja) * 1983-01-25 1984-08-04 Toshiba Corp 半導体装置とその製造方法
DE3535605C1 (de) * 1985-10-05 1986-12-04 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung
EP0257681A3 (en) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
US4884125A (en) * 1986-10-15 1989-11-28 Sanyo Electic Co., Ltd. Hybrid integrated circuit device capable of being inserted into socket
JPH0760880B2 (ja) * 1988-02-20 1995-06-28 ドイチエ・アイティーティー・インダストリーズ・ゲゼルシャフト・ミト・ベシュレンクタ・ハフツンク 半導体装置、その製造方法、その方法を実行するための装置、および組立装置
EP0336173A3 (en) * 1988-04-05 1990-04-25 Siemens Aktiengesellschaft Molded component package isolating interior substrate by recesses containing exposed breakoffs
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US5977630A (en) * 1997-08-15 1999-11-02 International Rectifier Corp. Plural semiconductor die housed in common package with split heat sink
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
JP2010073841A (ja) * 2008-09-18 2010-04-02 Sony Corp 光学パッケージ素子、表示装置、および電子機器
DE102013220880B4 (de) * 2013-10-15 2016-08-18 Infineon Technologies Ag Elektronisches Halbleitergehäuse mit einer elektrisch isolierenden, thermischen Schnittstellenstruktur auf einer Diskontinuität einer Verkapselungsstruktur sowie ein Herstellungsverfahren dafür und eine elektronische Anordung dies aufweisend
DE102015118245B4 (de) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Elektronische Komponente mit einem thermischen Schnittstellenmaterial, Herstellungsverfahren für eine elektronische Komponente, Wärmeabfuhrkörper mit einem thermischen Schnittstellenmaterial und thermisches Schnittstellenmaterial
JP1646470S (2) * 2019-05-14 2019-11-25

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS54159177A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Resin sealed semiconductor device
JPS5563854A (en) * 1978-11-08 1980-05-14 Nec Kyushu Ltd Method of manufacturing semiconductor device
JPS5587468A (en) * 1978-12-25 1980-07-02 Nec Corp Lead frame
JPS5596663A (en) * 1979-01-16 1980-07-23 Nec Corp Method of fabricating semiconductor device
JPS55108755A (en) * 1979-02-14 1980-08-21 Nec Corp Resin seal type semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716764A (en) * 1963-12-16 1973-02-13 Texas Instruments Inc Process for encapsulating electronic components in plastic
NL6903229A (2) * 1969-03-01 1970-09-03
US3611250A (en) * 1969-09-10 1971-10-05 Amp Inc Integrated circuit module and assembly
US3793709A (en) * 1972-04-24 1974-02-26 Texas Instruments Inc Process for making a plastic-encapsulated semiconductor device
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
JPS54111766A (en) * 1978-02-22 1979-09-01 Hitachi Ltd Coupling construction of lead and heat sink in semiconductor device
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
JPS5619646A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Resin sealing type semiconductor device
JPS5662344A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Resin sealed semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS54159177A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Resin sealed semiconductor device
JPS5563854A (en) * 1978-11-08 1980-05-14 Nec Kyushu Ltd Method of manufacturing semiconductor device
JPS5587468A (en) * 1978-12-25 1980-07-02 Nec Corp Lead frame
JPS5596663A (en) * 1979-01-16 1980-07-23 Nec Corp Method of fabricating semiconductor device
JPS55108755A (en) * 1979-02-14 1980-08-21 Nec Corp Resin seal type semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60128645A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
JPS60229352A (ja) * 1984-04-26 1985-11-14 Fuji Electric Co Ltd 樹脂封止形半導体装置および樹脂封止方法
JPS6415958A (en) * 1987-07-10 1989-01-19 Hitachi Ltd Resin-encapsulated semiconductor device

Also Published As

Publication number Publication date
EP0066188B1 (en) 1985-12-18
EP0066188A1 (en) 1982-12-08
JPS6227750B2 (2) 1987-06-16
DE3267996D1 (en) 1986-01-30
US4503452A (en) 1985-03-05
CA1180469A (en) 1985-01-02

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