JPS57197879A - Lead wire connection structure for air-cooled optoelectric transducer - Google Patents

Lead wire connection structure for air-cooled optoelectric transducer

Info

Publication number
JPS57197879A
JPS57197879A JP56083312A JP8331281A JPS57197879A JP S57197879 A JPS57197879 A JP S57197879A JP 56083312 A JP56083312 A JP 56083312A JP 8331281 A JP8331281 A JP 8331281A JP S57197879 A JPS57197879 A JP S57197879A
Authority
JP
Japan
Prior art keywords
air
lead wires
cooled
insulative substrate
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56083312A
Other languages
Japanese (ja)
Inventor
Masaaki Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56083312A priority Critical patent/JPS57197879A/en
Publication of JPS57197879A publication Critical patent/JPS57197879A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations

Landscapes

  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To improve working efficiency in connecting lead wires by a structure wherein contact electrodes corresponding to radial leads of an air-tight tubular body are provided on an insulative substrate having an opening through which the tubular body is inserted, and elastic pieces for pressing the lead wires are also provided thereon. CONSTITUTION:An insertion opening 12, through which an air-tight tubular body including an optoelectric transducer is inserted and enclosed therein, is formed at the center of a first insulative substrate 11, and contact electrodes 13 are disposed at positions corresponding to radial lead wires 3 fixed to a ceramic substrate 4 of the body. (14 denotes lead-out wires and 15 denotes shield electrodes). Then, a second insulative substrate having cutouts at positions corresponding to the contact electrodes 13 and a third insulative substrate having elastic pieces for pressing the lead wires are provided thereby to constitute a lead wire connection structure for an air-cooled optoelectric transducer. By so doing, working efficiency in connecting the lead wires is improved and reliability in connections is also improved.
JP56083312A 1981-05-29 1981-05-29 Lead wire connection structure for air-cooled optoelectric transducer Pending JPS57197879A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56083312A JPS57197879A (en) 1981-05-29 1981-05-29 Lead wire connection structure for air-cooled optoelectric transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56083312A JPS57197879A (en) 1981-05-29 1981-05-29 Lead wire connection structure for air-cooled optoelectric transducer

Publications (1)

Publication Number Publication Date
JPS57197879A true JPS57197879A (en) 1982-12-04

Family

ID=13798894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56083312A Pending JPS57197879A (en) 1981-05-29 1981-05-29 Lead wire connection structure for air-cooled optoelectric transducer

Country Status (1)

Country Link
JP (1) JPS57197879A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053850A (en) * 1988-03-14 1991-10-01 Motorola, Inc. Bonding pad for semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053850A (en) * 1988-03-14 1991-10-01 Motorola, Inc. Bonding pad for semiconductor devices

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