JPS57204154A - Structure of chip carrier - Google Patents

Structure of chip carrier

Info

Publication number
JPS57204154A
JPS57204154A JP56088968A JP8896881A JPS57204154A JP S57204154 A JPS57204154 A JP S57204154A JP 56088968 A JP56088968 A JP 56088968A JP 8896881 A JP8896881 A JP 8896881A JP S57204154 A JPS57204154 A JP S57204154A
Authority
JP
Japan
Prior art keywords
substrate
chip
chip carrier
bonding
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56088968A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634708B2 (2
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56088968A priority Critical patent/JPS57204154A/ja
Publication of JPS57204154A publication Critical patent/JPS57204154A/ja
Publication of JPS634708B2 publication Critical patent/JPS634708B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP56088968A 1981-06-09 1981-06-09 Structure of chip carrier Granted JPS57204154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56088968A JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56088968A JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Publications (2)

Publication Number Publication Date
JPS57204154A true JPS57204154A (en) 1982-12-14
JPS634708B2 JPS634708B2 (2) 1988-01-30

Family

ID=13957607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56088968A Granted JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Country Status (1)

Country Link
JP (1) JPS57204154A (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125641A (ja) * 1983-01-05 1984-07-20 Nec Corp リ−ドレスチツプキヤリア
JPS59125642A (ja) * 1983-01-05 1984-07-20 Nec Corp リ−ドレスチツプキヤリア
JPS629640A (ja) * 1985-07-08 1987-01-17 Nec Corp 半導体部品の実装構造
JPH06224259A (ja) * 1992-11-18 1994-08-12 Matsushita Electron Corp 半導体装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS55176571U (2) * 1979-06-05 1980-12-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS55176571U (2) * 1979-06-05 1980-12-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125641A (ja) * 1983-01-05 1984-07-20 Nec Corp リ−ドレスチツプキヤリア
JPS59125642A (ja) * 1983-01-05 1984-07-20 Nec Corp リ−ドレスチツプキヤリア
JPS629640A (ja) * 1985-07-08 1987-01-17 Nec Corp 半導体部品の実装構造
JPH06224259A (ja) * 1992-11-18 1994-08-12 Matsushita Electron Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS634708B2 (2) 1988-01-30

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