JPS5720444A - Feeding device for semiconductor wafer - Google Patents

Feeding device for semiconductor wafer

Info

Publication number
JPS5720444A
JPS5720444A JP9537480A JP9537480A JPS5720444A JP S5720444 A JPS5720444 A JP S5720444A JP 9537480 A JP9537480 A JP 9537480A JP 9537480 A JP9537480 A JP 9537480A JP S5720444 A JPS5720444 A JP S5720444A
Authority
JP
Japan
Prior art keywords
wafer
fork unit
jig
bodies
lowered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9537480A
Other languages
Japanese (ja)
Inventor
Mitsutake Nagashima
Shigeru Futagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP9537480A priority Critical patent/JPS5720444A/en
Publication of JPS5720444A publication Critical patent/JPS5720444A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Abstract

PURPOSE:To provide an automatic device generally used for the steps of manufacturing by placing wafers on cantilevered forks at the upper and lower members arranged at the reciprocating body, and transferring them between a carrier jig and a conveying table. CONSTITUTION:Fork unit 3 having recesses 3a is mounted on the upper and lower movable members 6 of bodies 4, 5. The fork unit 3 is raised, the bodies are driven by a cylinder 4, are guided by a shaft 8 movably, and the fork unit 3 is insertd to the lower part of the wafer 2 within the jig 1 placed on the elevationally movable base 19. After the base 19 is lowered and the wafer 2 is placed on the recess 3a, the body is moved to the position of a conveying table 13 (wafer 2), the upper and lower members 6 are lowered, and the wafer is moved onto the table 13. The wafer is reversely transferred from the table 13 to the jig 1 in the reverse steps. The existence or absence of the wafer 2 is detected by a photodetector 26 provided under the fork unit 3, thereby operating the device and effectively and safely transferring the wafer.
JP9537480A 1980-07-11 1980-07-11 Feeding device for semiconductor wafer Pending JPS5720444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9537480A JPS5720444A (en) 1980-07-11 1980-07-11 Feeding device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9537480A JPS5720444A (en) 1980-07-11 1980-07-11 Feeding device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5720444A true JPS5720444A (en) 1982-02-02

Family

ID=14135858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9537480A Pending JPS5720444A (en) 1980-07-11 1980-07-11 Feeding device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5720444A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594039A (en) * 1982-06-30 1984-01-10 Hitachi Ltd Wafer carrying apparatus
JPS61188331A (en) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk Wafer slice takeout device
JPS61258444A (en) * 1985-05-13 1986-11-15 Canon Inc Wafer position detecting device
JPS6251237A (en) * 1985-08-30 1987-03-05 Canon Inc Wafer transfer device
JPS64529U (en) * 1987-06-19 1989-01-05
JPH0249136U (en) * 1988-09-29 1990-04-05
JPH0272544U (en) * 1988-11-18 1990-06-01
JPH02148752A (en) * 1988-11-29 1990-06-07 Metsukusu:Kk Chucking hand for automatic conveyor of silicon wafer
US5133635A (en) * 1990-03-05 1992-07-28 Tet Techno Investment Trust Settlement Method and apparatus for holding and conveying platelike substrates
JPH04218942A (en) * 1991-03-23 1992-08-10 Tokyo Electron Ltd Water detection device
JPH1067428A (en) * 1997-03-28 1998-03-10 Texas Instr Japan Ltd Wafer slice storage / removal method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594039A (en) * 1982-06-30 1984-01-10 Hitachi Ltd Wafer carrying apparatus
JPS61188331A (en) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk Wafer slice takeout device
JPS61258444A (en) * 1985-05-13 1986-11-15 Canon Inc Wafer position detecting device
JPS6251237A (en) * 1985-08-30 1987-03-05 Canon Inc Wafer transfer device
JPS64529U (en) * 1987-06-19 1989-01-05
JPH0249136U (en) * 1988-09-29 1990-04-05
JPH0272544U (en) * 1988-11-18 1990-06-01
JPH02148752A (en) * 1988-11-29 1990-06-07 Metsukusu:Kk Chucking hand for automatic conveyor of silicon wafer
US5133635A (en) * 1990-03-05 1992-07-28 Tet Techno Investment Trust Settlement Method and apparatus for holding and conveying platelike substrates
JPH04218942A (en) * 1991-03-23 1992-08-10 Tokyo Electron Ltd Water detection device
JPH1067428A (en) * 1997-03-28 1998-03-10 Texas Instr Japan Ltd Wafer slice storage / removal method

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