JPS5731166A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5731166A
JPS5731166A JP10591180A JP10591180A JPS5731166A JP S5731166 A JPS5731166 A JP S5731166A JP 10591180 A JP10591180 A JP 10591180A JP 10591180 A JP10591180 A JP 10591180A JP S5731166 A JPS5731166 A JP S5731166A
Authority
JP
Japan
Prior art keywords
chips
pads
multilayer
package
inner pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10591180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355213B2 (2
Inventor
Junji Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10591180A priority Critical patent/JPS5731166A/ja
Publication of JPS5731166A publication Critical patent/JPS5731166A/ja
Publication of JPS6355213B2 publication Critical patent/JPS6355213B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/28—Configurations of stacked chips the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP10591180A 1980-07-31 1980-07-31 Semiconductor device Granted JPS5731166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10591180A JPS5731166A (en) 1980-07-31 1980-07-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10591180A JPS5731166A (en) 1980-07-31 1980-07-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5731166A true JPS5731166A (en) 1982-02-19
JPS6355213B2 JPS6355213B2 (2) 1988-11-01

Family

ID=14420041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10591180A Granted JPS5731166A (en) 1980-07-31 1980-07-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5731166A (2)

Cited By (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283634A (ja) * 1986-05-31 1987-12-09 Mitsubishi Electric Corp 半導体装置
US4866932A (en) * 1987-11-09 1989-09-19 Shin Caterpillar Mitsubishi Ltd. Apparatus for treating particulate emission from diesel engine
JPH0287635A (ja) * 1988-09-26 1990-03-28 Nec Corp セラミック・パッケージ型半導体装置
US4956695A (en) * 1989-05-12 1990-09-11 Rockwell International Corporation Three-dimensional packaging of focal plane assemblies using ceramic spacers
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5239447A (en) * 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5585668A (en) * 1995-01-30 1996-12-17 Staktek Corporation Integrated circuit package with overlapped die on a common lead frame
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5600183A (en) * 1994-11-15 1997-02-04 Hughes Electronics Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5783464A (en) * 1992-06-26 1998-07-21 Staktek Corporation Method of forming a hermetically sealed circuit lead-on package
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5804004A (en) * 1992-05-11 1998-09-08 Nchip, Inc. Stacked devices for multichip modules
US5886412A (en) * 1995-08-16 1999-03-23 Micron Technology, Inc. Angularly offset and recessed stacked die multichip device
KR19990061323A (ko) * 1997-12-31 1999-07-26 윤종용 반도체 패키지
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US6031279A (en) * 1996-09-02 2000-02-29 Siemens Aktiengesellschaft Power semiconductor component
US6051886A (en) * 1995-08-16 2000-04-18 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
JP2001274317A (ja) * 2000-03-27 2001-10-05 Toshiba Corp 半導体装置及び半導体装置の実装方法
US6353263B1 (en) * 1999-04-14 2002-03-05 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
JP2002076314A (ja) * 2000-08-30 2002-03-15 Texas Instr Japan Ltd 超小型撮像装置
US6452279B2 (en) * 2000-07-14 2002-09-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2002373966A (ja) * 2001-06-13 2002-12-26 Matsushita Electric Ind Co Ltd 半導体チップの実装構造体及びその製造方法
KR100379539B1 (ko) * 1999-12-30 2003-04-10 주식회사 하이닉스반도체 반도체 패키지 및 그의 제조방법
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US6867500B2 (en) * 2002-04-08 2005-03-15 Micron Technology, Inc. Multi-chip module and methods
US6884657B1 (en) 1995-08-16 2005-04-26 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6913949B2 (en) 2001-10-09 2005-07-05 Tessera, Inc. Stacked packages
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US7053485B2 (en) 2002-08-16 2006-05-30 Tessera, Inc. Microelectronic packages with self-aligning features
US7276437B2 (en) 1999-02-17 2007-10-02 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
JP2008515203A (ja) * 2004-09-27 2008-05-08 フォームファクター， インコーポレイテッド 積層されたダイモジュール
JP2008204037A (ja) * 2007-02-19 2008-09-04 Matsushita Electric Ind Co Ltd 半導体モジュールおよびカード型情報装置
US7427810B2 (en) 1999-07-01 2008-09-23 Oki Electric Industry Co., Ltd. Semiconductor device including semiconductor element mounted on another semiconductor element
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7652381B2 (en) * 2003-11-13 2010-01-26 Interconnect Portfolio Llc Interconnect system without through-holes
WO2010087213A1 (ja) * 2009-01-30 2010-08-05 株式会社新川 補正位置検出装置、補正位置検出方法及びボンディング装置
EP2355150A1 (en) * 2010-01-27 2011-08-10 Honeywell International Inc. Multi-tiered integrated circuit package
EP1671369A4 (en) * 2003-09-24 2011-08-17 Samsung Electronics Co Ltd MULTI-SURFACE IC CAPSULE STRUCTURES AND METHOD OF MANUFACTURING THEREOF
US8159062B2 (en) 2000-01-31 2012-04-17 Elpida Memory, Inc. Semiconductor and a method of manufacturing the same
USRE45463E1 (en) 2003-11-12 2015-04-14 Tessera, Inc. Stacked microelectronic assemblies with central contacts
US9741644B2 (en) 2015-05-04 2017-08-22 Honeywell International Inc. Stacking arrangement for integration of multiple integrated circuits
CN107889355A (zh) * 2017-11-10 2018-04-06 广东欧珀移动通信有限公司 一种电路板组件以及电子设备
CN109360809A (zh) * 2016-07-17 2019-02-19 何凡 叠层集成电路芯片封装结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081475A (2) * 1973-11-19 1975-07-02
JPS5561041A (en) * 1978-10-30 1980-05-08 Mitsubishi Electric Corp Packaging device for semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081475A (2) * 1973-11-19 1975-07-02
JPS5561041A (en) * 1978-10-30 1980-05-08 Mitsubishi Electric Corp Packaging device for semiconductor integrated circuit

Cited By (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283634A (ja) * 1986-05-31 1987-12-09 Mitsubishi Electric Corp 半導体装置
US4866932A (en) * 1987-11-09 1989-09-19 Shin Caterpillar Mitsubishi Ltd. Apparatus for treating particulate emission from diesel engine
JPH0287635A (ja) * 1988-09-26 1990-03-28 Nec Corp セラミック・パッケージ型半導体装置
US4956695A (en) * 1989-05-12 1990-09-11 Rockwell International Corporation Three-dimensional packaging of focal plane assemblies using ceramic spacers
US6168970B1 (en) 1990-08-01 2001-01-02 Staktek Group L.P. Ultra high density integrated circuit packages
US6049123A (en) * 1990-08-01 2000-04-11 Staktek Corporation Ultra high density integrated circuit packages
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5566051A (en) * 1990-08-01 1996-10-15 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5561591A (en) * 1990-08-01 1996-10-01 Staktek Corporation Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5550711A (en) * 1990-08-01 1996-08-27 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5239447A (en) * 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5804004A (en) * 1992-05-11 1998-09-08 Nchip, Inc. Stacked devices for multichip modules
US5783464A (en) * 1992-06-26 1998-07-21 Staktek Corporation Method of forming a hermetically sealed circuit lead-on package
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6919626B2 (en) 1992-12-11 2005-07-19 Staktek Group L.P. High density integrated circuit module
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5631193A (en) * 1992-12-11 1997-05-20 Staktek Corporation High density lead-on-package fabrication method
US5843807A (en) * 1993-03-29 1998-12-01 Staktek Corporation Method of manufacturing an ultra-high density warp-resistant memory module
US5895232A (en) * 1993-03-29 1999-04-20 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US6194247B1 (en) 1993-03-29 2001-02-27 Staktek Group L.P. Warp-resistent ultra-thin integrated circuit package fabrication method
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5581121A (en) * 1993-03-29 1996-12-03 Staktek Corporation Warp-resistant ultra-thin integrated circuit package
US5828125A (en) * 1993-03-29 1998-10-27 Staktek Corporation Ultra-high density warp-resistant memory module
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5864175A (en) * 1993-03-29 1999-01-26 Staktek Corporation Wrap-resistant ultra-thin integrated circuit package fabrication method
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5600183A (en) * 1994-11-15 1997-02-04 Hughes Electronics Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5585668A (en) * 1995-01-30 1996-12-17 Staktek Corporation Integrated circuit package with overlapped die on a common lead frame
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
US6884657B1 (en) 1995-08-16 2005-04-26 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US6051886A (en) * 1995-08-16 2000-04-18 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US5886412A (en) * 1995-08-16 1999-03-23 Micron Technology, Inc. Angularly offset and recessed stacked die multichip device
US6563205B1 (en) 1995-08-16 2003-05-13 Micron Technology, Inc. Angularly offset and recessed stacked die multichip device and method of manufacture
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US6031279A (en) * 1996-09-02 2000-02-29 Siemens Aktiengesellschaft Power semiconductor component
US6190939B1 (en) 1997-03-12 2001-02-20 Staktek Group L.P. Method of manufacturing a warp resistant thermally conductive circuit package
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6452260B1 (en) 1997-09-02 2002-09-17 Silicon Light Machines Electrical interface to integrated circuit device having high density I/O count
KR19990061323A (ko) * 1997-12-31 1999-07-26 윤종용 반도체 패키지
US7528011B2 (en) 1999-02-17 2009-05-05 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
US7276437B2 (en) 1999-02-17 2007-10-02 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
US6353263B1 (en) * 1999-04-14 2002-03-05 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
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