JPS5743449A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5743449A
JPS5743449A JP55119964A JP11996480A JPS5743449A JP S5743449 A JPS5743449 A JP S5743449A JP 55119964 A JP55119964 A JP 55119964A JP 11996480 A JP11996480 A JP 11996480A JP S5743449 A JPS5743449 A JP S5743449A
Authority
JP
Japan
Prior art keywords
lead frame
substrate
manufacture
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55119964A
Other languages
Japanese (ja)
Inventor
Eiji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55119964A priority Critical patent/JPS5743449A/en
Publication of JPS5743449A publication Critical patent/JPS5743449A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the exfoliation of a wiring lead frame from a substrate by securing in advance the lead frame to an external terminal lead frame and connecting the wiring lead frame to the substrate, thereby preventing the external force from being applied directly to the substrate. CONSTITUTION:A wiring lead frame 13 is secured in advance to an external terminal lead frame 11. Then, the lead frame 13 is connected to a substrate 3, and electric wiring is performed. Since external force is not applied directly to the substrate 3 in this manner, the lead frames 11, 13 are not exfoliated from the substrate 3.
JP55119964A 1980-08-28 1980-08-28 Manufacture of hybrid integrated circuit Pending JPS5743449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55119964A JPS5743449A (en) 1980-08-28 1980-08-28 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119964A JPS5743449A (en) 1980-08-28 1980-08-28 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5743449A true JPS5743449A (en) 1982-03-11

Family

ID=14774549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119964A Pending JPS5743449A (en) 1980-08-28 1980-08-28 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5743449A (en)

Similar Documents

Publication Publication Date Title
EP0295459A3 (en) Electronic assembly and method of making it
JPS6428930A (en) Semiconductor device
HK70887A (en) Semiconductor device and a method of producing the same
JPS5591849A (en) Module for microwave device
JPS52120768A (en) Semiconductor device
JPS5779652A (en) Resin-sealed semiconductor device
JPS5764953A (en) Semiconductor device
JPS52127756A (en) Semiconductor unit
JPS5582454A (en) Container for integrated circuit element
JPS5548943A (en) Composite integrated circuit
JPS5743450A (en) Manufacture of hybrid integrated circuit
HK89392A (en) A circuit unit for a timepiece and a method of making the same
JPS52154358A (en) Production of semiconductor device
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS522281A (en) Method of making semiconductor devices
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS56158462A (en) Lead frame for single inline semiconductor device
JPS5745957A (en) Circuit substrate and manufacture thereof
JPS5629355A (en) Manufacture of resin-sealed semiconductor device
JPS5740672A (en) Electronic watch
JPS5533077A (en) Hybrid integrated circuit
JPS53110370A (en) Semiconductor device
FR2311404B1 (en)
JPS51126763A (en) Electronic circuit unit manufacturing process
JPS6455295A (en) Integrated circuit device