JPS574742A - Manufacture of polyvinyl chloride foam molded component - Google Patents

Manufacture of polyvinyl chloride foam molded component

Info

Publication number
JPS574742A
JPS574742A JP7969180A JP7969180A JPS574742A JP S574742 A JPS574742 A JP S574742A JP 7969180 A JP7969180 A JP 7969180A JP 7969180 A JP7969180 A JP 7969180A JP S574742 A JPS574742 A JP S574742A
Authority
JP
Japan
Prior art keywords
heat
plastisol
component
foam
foam molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7969180A
Other languages
Japanese (ja)
Other versions
JPH0120177B2 (en
Inventor
Shinichi Takahashi
Yukio Haneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aron Kasei Co Ltd
Original Assignee
Aron Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aron Kasei Co Ltd filed Critical Aron Kasei Co Ltd
Priority to JP7969180A priority Critical patent/JPS574742A/en
Publication of JPS574742A publication Critical patent/JPS574742A/en
Publication of JPH0120177B2 publication Critical patent/JPH0120177B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

PURPOSE: To obtain the captioned component having fine isolated cells alone or in admixture with interconnected cells in a homogeneously dispersed state, by employing, as a foaming agent, heat-expandable microcapsules which can foam at temperatures lower than the molding temperatures of resin materials used in the conventional process.
CONSTITUTION: To 100pts.wt. of paste resin of a PVC are added 40pts.wt. or less of heat-expandable microcapsules (for example formed from a copolymer consisting of mainly vinylidene chloride and acrylonitrile or the like) as a foaming agent to prepare a plastisol, and after this plastisol is melted by heat, by accelerating the gasification of the microcapsules caused by the latent heat when it gels, the plastisol is subjected to foam molding at low temperatures of about 170°C or below within 200sec to produce the captioned foam molded component. According to the present method, the foamed component having agreeable feeling and including fine isolated cells alone or in admixture with interconnected cells in a homogeneously dispersed state can be obtained on industrial scale.
COPYRIGHT: (C)1982,JPO&Japio
JP7969180A 1980-06-12 1980-06-12 Manufacture of polyvinyl chloride foam molded component Granted JPS574742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7969180A JPS574742A (en) 1980-06-12 1980-06-12 Manufacture of polyvinyl chloride foam molded component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7969180A JPS574742A (en) 1980-06-12 1980-06-12 Manufacture of polyvinyl chloride foam molded component

Publications (2)

Publication Number Publication Date
JPS574742A true JPS574742A (en) 1982-01-11
JPH0120177B2 JPH0120177B2 (en) 1989-04-14

Family

ID=13697219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7969180A Granted JPS574742A (en) 1980-06-12 1980-06-12 Manufacture of polyvinyl chloride foam molded component

Country Status (1)

Country Link
JP (1) JPS574742A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141074A (en) * 1985-12-17 1987-06-24 Nippon Tokushu Toryo Kk Super-lightweight chipping-resistant coating
JPH01163226A (en) * 1987-11-30 1989-06-27 Toppan Printing Co Ltd Production of expanded decorative material
WO2004060986A1 (en) * 2003-01-06 2004-07-22 Sekisui Chemical Co., Ltd. Expandable resin composition
JP2019167453A (en) * 2018-03-23 2019-10-03 積水化学工業株式会社 Resin composition for molding and foam molded body

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015854A (en) * 1973-06-13 1975-02-19
JPS51102191A (en) * 1975-02-03 1976-09-09 Pratt & Lambert Inc Sentaku oyobi doraikuriiningukanonaryukipurintokeiseihoho
JPS5334863A (en) * 1976-07-23 1978-03-31 Polymerics Inc Polymer foam coating material
JPS54155266A (en) * 1978-05-30 1979-12-07 Dainichi Seika Kogyo Kk Heat dilatable resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015854A (en) * 1973-06-13 1975-02-19
JPS51102191A (en) * 1975-02-03 1976-09-09 Pratt & Lambert Inc Sentaku oyobi doraikuriiningukanonaryukipurintokeiseihoho
JPS5334863A (en) * 1976-07-23 1978-03-31 Polymerics Inc Polymer foam coating material
JPS54155266A (en) * 1978-05-30 1979-12-07 Dainichi Seika Kogyo Kk Heat dilatable resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141074A (en) * 1985-12-17 1987-06-24 Nippon Tokushu Toryo Kk Super-lightweight chipping-resistant coating
JPH01163226A (en) * 1987-11-30 1989-06-27 Toppan Printing Co Ltd Production of expanded decorative material
WO2004060986A1 (en) * 2003-01-06 2004-07-22 Sekisui Chemical Co., Ltd. Expandable resin composition
JP2019167453A (en) * 2018-03-23 2019-10-03 積水化学工業株式会社 Resin composition for molding and foam molded body

Also Published As

Publication number Publication date
JPH0120177B2 (en) 1989-04-14

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