JPS5779681A - Light emitting chip parts - Google Patents

Light emitting chip parts

Info

Publication number
JPS5779681A
JPS5779681A JP55154952A JP15495280A JPS5779681A JP S5779681 A JPS5779681 A JP S5779681A JP 55154952 A JP55154952 A JP 55154952A JP 15495280 A JP15495280 A JP 15495280A JP S5779681 A JPS5779681 A JP S5779681A
Authority
JP
Japan
Prior art keywords
chip
substrate
conductor
light emitting
chip part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55154952A
Other languages
Japanese (ja)
Inventor
Tetsuhiro Kiyono
Kouichi Kasuo
Yoshizo Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP55154952A priority Critical patent/JPS5779681A/en
Publication of JPS5779681A publication Critical patent/JPS5779681A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To mount a chip part with an LED on a printed substrate with good workability by previously mounting the LED on an insulating chip substrate. CONSTITUTION:The first and the second conductors 2, 2' are formed on the upper surface of an angular chip substrate or chipped substrate 1 consisting of insulating material. The first conductor 2 is provided with an extension 3 extended towards the second conductor 2' and a chip-shaped light emitting diode element 4 having a lower electrode and an upper electrode is mounted on the extension 3 by bonding connection. The rear of the chip part C composed by the above process is adhered to a printed substrate 7 by applying adhesive 9 to the rear of the chip part C. And next, the conductors 2, 2' on the chip part C and a conductor 8 on the printed substrate 7 are soldered or connected by conductive silver paste 10.
JP55154952A 1980-11-04 1980-11-04 Light emitting chip parts Pending JPS5779681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55154952A JPS5779681A (en) 1980-11-04 1980-11-04 Light emitting chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55154952A JPS5779681A (en) 1980-11-04 1980-11-04 Light emitting chip parts

Publications (1)

Publication Number Publication Date
JPS5779681A true JPS5779681A (en) 1982-05-18

Family

ID=15595496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55154952A Pending JPS5779681A (en) 1980-11-04 1980-11-04 Light emitting chip parts

Country Status (1)

Country Link
JP (1) JPS5779681A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957876A (en) * 1987-06-05 1990-09-18 Nippondenso Co., Ltd. Resin sealed semiconductor device and a method for making the same
JPH0322486A (en) * 1989-05-31 1991-01-30 Siemens Ag Opto-device to which surface mounting is enabled
EP0996172A1 (en) * 1998-10-23 2000-04-26 Rohm Co., Ltd. Chip type semiconductor light emitting device
DE10063876B4 (en) * 2000-12-21 2009-02-26 Continental Automotive Gmbh From a variety of LEDs existing light source
US7982227B2 (en) 2006-06-27 2011-07-19 Everlight Electronics Co., Ltd. Light emitting diode package
JP2019067903A (en) * 2017-09-29 2019-04-25 日亜化学工業株式会社 Light emitting device and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957876A (en) * 1987-06-05 1990-09-18 Nippondenso Co., Ltd. Resin sealed semiconductor device and a method for making the same
JPH0322486A (en) * 1989-05-31 1991-01-30 Siemens Ag Opto-device to which surface mounting is enabled
EP0996172A1 (en) * 1998-10-23 2000-04-26 Rohm Co., Ltd. Chip type semiconductor light emitting device
US6180962B1 (en) 1998-10-23 2001-01-30 Rohm Co., Ltd. Chip type semiconductor light emitting device having a solder preventive portion
DE10063876B4 (en) * 2000-12-21 2009-02-26 Continental Automotive Gmbh From a variety of LEDs existing light source
US7982227B2 (en) 2006-06-27 2011-07-19 Everlight Electronics Co., Ltd. Light emitting diode package
JP2019067903A (en) * 2017-09-29 2019-04-25 日亜化学工業株式会社 Light emitting device and method of manufacturing the same

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