JPS5771149A - Electrode structure of semiconductor device - Google Patents

Electrode structure of semiconductor device

Info

Publication number
JPS5771149A
JPS5771149A JP55146958A JP14695880A JPS5771149A JP S5771149 A JPS5771149 A JP S5771149A JP 55146958 A JP55146958 A JP 55146958A JP 14695880 A JP14695880 A JP 14695880A JP S5771149 A JPS5771149 A JP S5771149A
Authority
JP
Japan
Prior art keywords
hole
bump
psg film
type region
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55146958A
Other languages
English (en)
Inventor
Hiroshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55146958A priority Critical patent/JPS5771149A/ja
Publication of JPS5771149A publication Critical patent/JPS5771149A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP55146958A 1980-10-22 1980-10-22 Electrode structure of semiconductor device Pending JPS5771149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55146958A JPS5771149A (en) 1980-10-22 1980-10-22 Electrode structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55146958A JPS5771149A (en) 1980-10-22 1980-10-22 Electrode structure of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5771149A true JPS5771149A (en) 1982-05-01

Family

ID=15419422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55146958A Pending JPS5771149A (en) 1980-10-22 1980-10-22 Electrode structure of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5771149A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601871A (ja) * 1983-06-20 1985-01-08 Sanken Electric Co Ltd 高耐圧半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831382A (ja) * 1971-08-31 1973-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831382A (ja) * 1971-08-31 1973-04-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601871A (ja) * 1983-06-20 1985-01-08 Sanken Electric Co Ltd 高耐圧半導体装置

Similar Documents

Publication Publication Date Title
JPS5771149A (en) Electrode structure of semiconductor device
IE822988L (en) Multilayer electrode of a semiconductor device
JPS5617025A (en) Semiconductor device
JPS5694663A (en) Semiconductor device
JPS5768040A (en) Electrode structure for semiconductor device
JPS523383A (en) Manufacturing method of semiconductor device electrode
JPS55103762A (en) Dhd glass-sealed diode
JPS56133872A (en) Manufacture of semiconductor device
JPS6439059A (en) Semiconductor device
JPS55107258A (en) Electrode construction for semiconductor element
JPS5656674A (en) Mosfet of high pressure resisting property and preparation thereof
JPS56105670A (en) Semiconductor device
JPS5779651A (en) Semiconductor device
JPS52117063A (en) Preparation of ohmic ontact layer in semiconductor device
JPS5419690A (en) Electrode of semiconductor devices
JPS57139942A (en) Manufacture of semiconductor device
JPS5633863A (en) Semiconductor device
JPS5768052A (en) Semiconductor device
JPS5691467A (en) Dhd sealed semiconductor
JPS57109350A (en) Semiconductor device
JPS5735370A (en) Semiconductor device
JPS55153360A (en) Glass sealing type semiconductor device
JPS57147266A (en) Condenser structure for integrated circuit
JPS572548A (en) Ic electrode structure
JPS57114242A (en) Semiconductor device