JPS5773930A - Forming method for polycrystalline silicon film with addition of impurities for diffusion source - Google Patents
Forming method for polycrystalline silicon film with addition of impurities for diffusion sourceInfo
- Publication number
- JPS5773930A JPS5773930A JP55149363A JP14936380A JPS5773930A JP S5773930 A JPS5773930 A JP S5773930A JP 55149363 A JP55149363 A JP 55149363A JP 14936380 A JP14936380 A JP 14936380A JP S5773930 A JPS5773930 A JP S5773930A
- Authority
- JP
- Japan
- Prior art keywords
- impurities
- addition
- forming method
- polycrystalline silicon
- silicon film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
PURPOSE:To obtain doped polymeric Si for diffusion with excellent repeatability by injecting SiH4 and PH3 in a thermally-controlled ambience by using Ar as a carrier. CONSTITUTION:An opening is made is SiO2 on an Si substrate, and SiH4 and PH3 are injected in a furnace with Ar used as a carrier and at a temperature controlled to be 900 deg.C, whereby PSG is piled in the opening part. Since an Si3N4 film or the like which prevents diffusion of P is not formed between the substrate and the PSG by this constitution, the diffusion of impurities can be performed excellently.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55149363A JPS5773930A (en) | 1980-10-27 | 1980-10-27 | Forming method for polycrystalline silicon film with addition of impurities for diffusion source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55149363A JPS5773930A (en) | 1980-10-27 | 1980-10-27 | Forming method for polycrystalline silicon film with addition of impurities for diffusion source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5773930A true JPS5773930A (en) | 1982-05-08 |
Family
ID=15473494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55149363A Pending JPS5773930A (en) | 1980-10-27 | 1980-10-27 | Forming method for polycrystalline silicon film with addition of impurities for diffusion source |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5773930A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887772A (en) * | 1972-02-18 | 1973-11-17 |
-
1980
- 1980-10-27 JP JP55149363A patent/JPS5773930A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887772A (en) * | 1972-02-18 | 1973-11-17 |
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