JPS5780752A - Lead for semiconductor element - Google Patents

Lead for semiconductor element

Info

Publication number
JPS5780752A
JPS5780752A JP55156402A JP15640280A JPS5780752A JP S5780752 A JPS5780752 A JP S5780752A JP 55156402 A JP55156402 A JP 55156402A JP 15640280 A JP15640280 A JP 15640280A JP S5780752 A JPS5780752 A JP S5780752A
Authority
JP
Japan
Prior art keywords
lead
disc
hole
metal
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55156402A
Other languages
Japanese (ja)
Inventor
Koji Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp Japan Ltd, Infineon Technologies Americas Corp, International Rectifier Corp USA filed Critical International Rectifier Corp Japan Ltd
Priority to JP55156402A priority Critical patent/JPS5780752A/en
Publication of JPS5780752A publication Critical patent/JPS5780752A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To largely reduce the production cost of a semiconductor element by connecting a metallic lead to a disc covered with metal similar in thermal expansion coefficient to the Si pellet. CONSTITUTION:A hole to which a metallic lead is inserted is formed at the center of a disc 3, and an expanded diameter part 4a is formed at the opening end of the hole. A conductive layer 5 of metal having similar thermal expansion coefficient to the Si pellet is formed at the disc 3. Then, a lead 1 formed at one end with a header 1a is inserted into the hole 4, and the header of the lead 1 and one end of the shaft are connected via a solder 6. According to this structure, the entire disc 3 is not formed of expensive metal such as Mo, and accordingly the production cost can be remarkably reduced.
JP55156402A 1980-11-06 1980-11-06 Lead for semiconductor element Pending JPS5780752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55156402A JPS5780752A (en) 1980-11-06 1980-11-06 Lead for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55156402A JPS5780752A (en) 1980-11-06 1980-11-06 Lead for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5780752A true JPS5780752A (en) 1982-05-20

Family

ID=15626948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55156402A Pending JPS5780752A (en) 1980-11-06 1980-11-06 Lead for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5780752A (en)

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