JPS58105138U - 半導体装置用自動ボンデイング装置 - Google Patents

半導体装置用自動ボンデイング装置

Info

Publication number
JPS58105138U
JPS58105138U JP1982002973U JP297382U JPS58105138U JP S58105138 U JPS58105138 U JP S58105138U JP 1982002973 U JP1982002973 U JP 1982002973U JP 297382 U JP297382 U JP 297382U JP S58105138 U JPS58105138 U JP S58105138U
Authority
JP
Japan
Prior art keywords
semiconductor devices
capillary
automatic bonding
bonding equipment
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982002973U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344996Y2 (2
Inventor
秀樹 岡崎
Original Assignee
日本テキサス・インスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本テキサス・インスツルメンツ株式会社 filed Critical 日本テキサス・インスツルメンツ株式会社
Priority to JP1982002973U priority Critical patent/JPS58105138U/ja
Publication of JPS58105138U publication Critical patent/JPS58105138U/ja
Application granted granted Critical
Publication of JPS6344996Y2 publication Critical patent/JPS6344996Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982002973U 1982-01-13 1982-01-13 半導体装置用自動ボンデイング装置 Granted JPS58105138U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982002973U JPS58105138U (ja) 1982-01-13 1982-01-13 半導体装置用自動ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982002973U JPS58105138U (ja) 1982-01-13 1982-01-13 半導体装置用自動ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58105138U true JPS58105138U (ja) 1983-07-18
JPS6344996Y2 JPS6344996Y2 (2) 1988-11-22

Family

ID=30015924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982002973U Granted JPS58105138U (ja) 1982-01-13 1982-01-13 半導体装置用自動ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58105138U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277142A (ja) * 2004-03-25 2005-10-06 Fujitsu Ltd ボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277142A (ja) * 2004-03-25 2005-10-06 Fujitsu Ltd ボンディング装置

Also Published As

Publication number Publication date
JPS6344996Y2 (2) 1988-11-22

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