JPS5816074A - 金または金合金膜のエツチング方法 - Google Patents
金または金合金膜のエツチング方法Info
- Publication number
- JPS5816074A JPS5816074A JP56113958A JP11395881A JPS5816074A JP S5816074 A JPS5816074 A JP S5816074A JP 56113958 A JP56113958 A JP 56113958A JP 11395881 A JP11395881 A JP 11395881A JP S5816074 A JPS5816074 A JP S5816074A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- gold
- acid
- alloy film
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56113958A JPS5816074A (ja) | 1981-07-20 | 1981-07-20 | 金または金合金膜のエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56113958A JPS5816074A (ja) | 1981-07-20 | 1981-07-20 | 金または金合金膜のエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5816074A true JPS5816074A (ja) | 1983-01-29 |
| JPS6214033B2 JPS6214033B2 (2) | 1987-03-31 |
Family
ID=14625464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56113958A Granted JPS5816074A (ja) | 1981-07-20 | 1981-07-20 | 金または金合金膜のエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5816074A (2) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187299U (ja) * | 1984-05-22 | 1985-12-11 | 安原鉄工株式会社 | 駆動装置内蔵型電動シヤツタ−の停止装置 |
| JP2006199987A (ja) * | 2005-01-19 | 2006-08-03 | Mitsubishi Chemicals Corp | エッチング液及びエッチング方法 |
| WO2008026542A1 (en) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemical Corporation | Etchant and etching process |
-
1981
- 1981-07-20 JP JP56113958A patent/JPS5816074A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187299U (ja) * | 1984-05-22 | 1985-12-11 | 安原鉄工株式会社 | 駆動装置内蔵型電動シヤツタ−の停止装置 |
| JP2006199987A (ja) * | 2005-01-19 | 2006-08-03 | Mitsubishi Chemicals Corp | エッチング液及びエッチング方法 |
| WO2008026542A1 (en) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemical Corporation | Etchant and etching process |
| JPWO2008026542A1 (ja) * | 2006-08-28 | 2010-01-21 | 三菱化学株式会社 | エッチング液及びエッチング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6214033B2 (2) | 1987-03-31 |
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