JPS5826014A - シリコン窒化膜の形成方法 - Google Patents

シリコン窒化膜の形成方法

Info

Publication number
JPS5826014A
JPS5826014A JP11919481A JP11919481A JPS5826014A JP S5826014 A JPS5826014 A JP S5826014A JP 11919481 A JP11919481 A JP 11919481A JP 11919481 A JP11919481 A JP 11919481A JP S5826014 A JPS5826014 A JP S5826014A
Authority
JP
Japan
Prior art keywords
silicon nitride
nitride film
gaseous
film
temp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11919481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6310893B2 (it
Inventor
Kenji Ikeda
健志 池田
Kazuhisa Takahashi
和久 高橋
Jun Osawa
大沢 潤
Wataru Suzaki
須崎 渉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP11919481A priority Critical patent/JPS5826014A/ja
Publication of JPS5826014A publication Critical patent/JPS5826014A/ja
Publication of JPS6310893B2 publication Critical patent/JPS6310893B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
JP11919481A 1981-07-31 1981-07-31 シリコン窒化膜の形成方法 Granted JPS5826014A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11919481A JPS5826014A (ja) 1981-07-31 1981-07-31 シリコン窒化膜の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11919481A JPS5826014A (ja) 1981-07-31 1981-07-31 シリコン窒化膜の形成方法

Publications (2)

Publication Number Publication Date
JPS5826014A true JPS5826014A (ja) 1983-02-16
JPS6310893B2 JPS6310893B2 (it) 1988-03-10

Family

ID=14755243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11919481A Granted JPS5826014A (ja) 1981-07-31 1981-07-31 シリコン窒化膜の形成方法

Country Status (1)

Country Link
JP (1) JPS5826014A (it)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421171A (en) * 1977-07-18 1979-02-17 Matsushita Electric Ind Co Ltd Manufacture for compound semiconductor device
JPS5664442A (en) * 1979-10-30 1981-06-01 Mitsubishi Electric Corp Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421171A (en) * 1977-07-18 1979-02-17 Matsushita Electric Ind Co Ltd Manufacture for compound semiconductor device
JPS5664442A (en) * 1979-10-30 1981-06-01 Mitsubishi Electric Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6310893B2 (it) 1988-03-10

Similar Documents

Publication Publication Date Title
KR920003291B1 (ko) 반도체 장치 제조방법
KR100497262B1 (ko) 화합물반도체의기상에피텍시방법
US5227006A (en) Method for selectively growing gallium-containing layers
US4235650A (en) Open tube aluminum diffusion
JPS5856963B2 (ja) 電子発光化合物半導体の製造方法
JPS5826014A (ja) シリコン窒化膜の形成方法
JP3386302B2 (ja) 化合物半導体へのn型ドーピング方法およびこれを用いた化学ビーム堆積方法並びにこれらの結晶成長方法によって形成された化合物半導体結晶およびこの化合物半導体結晶によって構成された電子デバイスおよび光デバイス
GB1582063A (en) Electroluminescent element and method of fabricating the same
EP0345859A1 (fr) Procédé de réalisation de couches épitaxiales
JPH04328823A (ja) 発光ダイオ−ド用エピタキシャルウエハの製造方法
JPH08335555A (ja) エピタキシャルウエハの製造方法
JPH11307458A (ja) 窒化物系化合物半導体の製造方法
JP3324221B2 (ja) Iii −v族化合物半導体デバイスの製造方法
JPH04328878A (ja) 発光ダイオ−ド用エピタキシャルウエハの製造方法
JP2735190B2 (ja) 分子線エピタキシヤル成長方法及び成長装置
JPH0388324A (ja) 化合物半導体薄膜の形成方法
JPH0463040B2 (it)
JPH04155831A (ja) 窒化燐絶縁膜の形成方法
JP3392888B2 (ja) アルミニウムを含む層の選択成長法
KR100623800B1 (ko) 질화규소의 증착방법
US3445300A (en) Method of epitaxial deposition wherein spent reaction gases are added to fresh reaction gas as a viscosity-increasing component
JP2617486B2 (ja) ▲iii▼−v化合物半導体の熱処理方法
ES300735A1 (es) Un metodo de fabricar dispositivos semiconductores
JPS5928330A (ja) 半導体の気相成長方法
JP2730262B2 (ja) 半導体素子の製造方法