JPS6073249U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS6073249U
JPS6073249U JP1983166234U JP16623483U JPS6073249U JP S6073249 U JPS6073249 U JP S6073249U JP 1983166234 U JP1983166234 U JP 1983166234U JP 16623483 U JP16623483 U JP 16623483U JP S6073249 U JPS6073249 U JP S6073249U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
sectional area
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983166234U
Other languages
English (en)
Inventor
豊 脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983166234U priority Critical patent/JPS6073249U/ja
Publication of JPS6073249U publication Critical patent/JPS6073249U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示した透視図である。 １．２，３・・・・・・外部リード、４・・・・・・チ
ップ、５・・・・・・ボンディングワイヤ、６・・・・
・・樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止半導体装置において、外部導出用リードの一部
    の断面積が小さく、且つ前記外部導出用リードの断面積
    が小さくなった部分は樹脂で封止されることなく露出し
    ていることを特徴とする樹脂封止半導体装置。
JP1983166234U 1983-10-27 1983-10-27 樹脂封止半導体装置 Pending JPS6073249U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983166234U JPS6073249U (ja) 1983-10-27 1983-10-27 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983166234U JPS6073249U (ja) 1983-10-27 1983-10-27 樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
JPS6073249U true JPS6073249U (ja) 1985-05-23

Family

ID=30363982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983166234U Pending JPS6073249U (ja) 1983-10-27 1983-10-27 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6073249U (ja)

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