JPS5844843U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5844843U
JPS5844843U JP1981139983U JP13998381U JPS5844843U JP S5844843 U JPS5844843 U JP S5844843U JP 1981139983 U JP1981139983 U JP 1981139983U JP 13998381 U JP13998381 U JP 13998381U JP S5844843 U JPS5844843 U JP S5844843U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
semiconductor device
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981139983U
Other languages
English (en)
Inventor
芳岡　勇行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981139983U priority Critical patent/JPS5844843U/ja
Publication of JPS5844843U publication Critical patent/JPS5844843U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂはそれぞれ従来のリードフレームのマ
ウント部の平面図およびＡ−Ａ’断面図、第２図ａ、　
　ｂは夫々穴のあいたリードフレームのマ：　　ラント
部の平面図および断面図であ゛る。 １・・・・・・リードフレームマウント部（アイランド
）、２・・・・・・ＩＣペレット（半導体素子）、３・
・・・・・穴、４・・・・・・マウント材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子がリードフレームのアイランド部に接着され
    た半導体装置において、上記アイランド部の上記半導体
    素子周辺が位置する部分に少くとも一ケ所以上の穴を有
    することを特徴とする半導体装置。
JP1981139983U 1981-09-21 1981-09-21 半導体装置 Pending JPS5844843U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981139983U JPS5844843U (ja) 1981-09-21 1981-09-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981139983U JPS5844843U (ja) 1981-09-21 1981-09-21 半導体装置

Publications (1)

Publication Number Publication Date
JPS5844843U true JPS5844843U (ja) 1983-03-25

Family

ID=29933158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981139983U Pending JPS5844843U (ja) 1981-09-21 1981-09-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS5844843U (ja)

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