JPS5851442U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS5851442U
JPS5851442U JP1981146442U JP14644281U JPS5851442U JP S5851442 U JPS5851442 U JP S5851442U JP 1981146442 U JP1981146442 U JP 1981146442U JP 14644281 U JP14644281 U JP 14644281U JP S5851442 U JPS5851442 U JP S5851442U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
semiconductor element
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981146442U
Other languages
English (en)
Inventor
中村　茂美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981146442U priority Critical patent/JPS5851442U/ja
Publication of JPS5851442U publication Critical patent/JPS5851442U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の例を示す部分平面図、第２図は本考案の
一実施例を示す部分平面図である。 １．１′・・・半導体素子、２．　２’・・・グイボン
ティング用合金またはペースト、３．　３’・・・ワイ
ヤボンドのステッチランド、４．　４’・・・ボンディ
ングワイヤ、５，５′・・・他の配線導体、６・・・半
導体素子のグイボンディングランド、７・・・印刷され
た絶縁体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 厚膜印刷された絶縁基板に半導体素子を接着して成る混
    成集積回路装置に於いて、該半導体素子の搭載領域の全
    周に渡って帯状に絶縁体を形成したことを特徴とする混
    成集積回路装置。
JP1981146442U 1981-10-01 1981-10-01 混成集積回路装置 Pending JPS5851442U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981146442U JPS5851442U (ja) 1981-10-01 1981-10-01 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981146442U JPS5851442U (ja) 1981-10-01 1981-10-01 混成集積回路装置

Publications (1)

Publication Number Publication Date
JPS5851442U true JPS5851442U (ja) 1983-04-07

Family

ID=29939348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981146442U Pending JPS5851442U (ja) 1981-10-01 1981-10-01 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS5851442U (ja)

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