JPS5851512A - 半導体装置の電極形成方法 - Google Patents
半導体装置の電極形成方法Info
- Publication number
- JPS5851512A JPS5851512A JP56150321A JP15032181A JPS5851512A JP S5851512 A JPS5851512 A JP S5851512A JP 56150321 A JP56150321 A JP 56150321A JP 15032181 A JP15032181 A JP 15032181A JP S5851512 A JPS5851512 A JP S5851512A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- film
- forming
- electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
Landscapes
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56150321A JPS5851512A (ja) | 1981-09-22 | 1981-09-22 | 半導体装置の電極形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56150321A JPS5851512A (ja) | 1981-09-22 | 1981-09-22 | 半導体装置の電極形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5851512A true JPS5851512A (ja) | 1983-03-26 |
| JPH0142491B2 JPH0142491B2 (2) | 1989-09-13 |
Family
ID=15494461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56150321A Granted JPS5851512A (ja) | 1981-09-22 | 1981-09-22 | 半導体装置の電極形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5851512A (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01131647U (2) * | 1988-02-26 | 1989-09-06 | ||
| US7579692B2 (en) | 2000-09-04 | 2009-08-25 | Seiko Epson Corporation | Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
-
1981
- 1981-09-22 JP JP56150321A patent/JPS5851512A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01131647U (2) * | 1988-02-26 | 1989-09-06 | ||
| US7579692B2 (en) | 2000-09-04 | 2009-08-25 | Seiko Epson Corporation | Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142491B2 (2) | 1989-09-13 |
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