JPS5863144A - ボンデイングワイヤ姿勢検査方法 - Google Patents

ボンデイングワイヤ姿勢検査方法

Info

Publication number
JPS5863144A
JPS5863144A JP56163213A JP16321381A JPS5863144A JP S5863144 A JPS5863144 A JP S5863144A JP 56163213 A JP56163213 A JP 56163213A JP 16321381 A JP16321381 A JP 16321381A JP S5863144 A JPS5863144 A JP S5863144A
Authority
JP
Japan
Prior art keywords
wire
wirings
light
attitude
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56163213A
Other languages
English (en)
Japanese (ja)
Other versions
JPS649732B2 (mo
Inventor
Hayashi Kuroki
黒木　林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56163213A priority Critical patent/JPS5863144A/ja
Publication of JPS5863144A publication Critical patent/JPS5863144A/ja
Publication of JPS649732B2 publication Critical patent/JPS649732B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP56163213A 1981-10-12 1981-10-12 ボンデイングワイヤ姿勢検査方法 Granted JPS5863144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56163213A JPS5863144A (ja) 1981-10-12 1981-10-12 ボンデイングワイヤ姿勢検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56163213A JPS5863144A (ja) 1981-10-12 1981-10-12 ボンデイングワイヤ姿勢検査方法

Publications (2)

Publication Number Publication Date
JPS5863144A true JPS5863144A (ja) 1983-04-14
JPS649732B2 JPS649732B2 (mo) 1989-02-20

Family

ID=15769443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56163213A Granted JPS5863144A (ja) 1981-10-12 1981-10-12 ボンデイングワイヤ姿勢検査方法

Country Status (1)

Country Link
JP (1) JPS5863144A (mo)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366945A (ja) * 1986-09-06 1988-03-25 Rohm Co Ltd ワイヤボンデイング不良検出方法およびこれに用いる装置
JPH02189948A (ja) * 1989-01-18 1990-07-25 Nec Corp 半導体のボンディング装置
EP0446838A3 (en) * 1990-03-12 1992-01-15 Fujitsu Limited Method of and apparatus for inspection of bonding wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366945A (ja) * 1986-09-06 1988-03-25 Rohm Co Ltd ワイヤボンデイング不良検出方法およびこれに用いる装置
JPH02189948A (ja) * 1989-01-18 1990-07-25 Nec Corp 半導体のボンディング装置
EP0446838A3 (en) * 1990-03-12 1992-01-15 Fujitsu Limited Method of and apparatus for inspection of bonding wire
US5298989A (en) * 1990-03-12 1994-03-29 Fujitsu Limited Method of and apparatus for multi-image inspection of bonding wire

Also Published As

Publication number Publication date
JPS649732B2 (mo) 1989-02-20

Similar Documents

Publication Publication Date Title
US6528330B2 (en) Semiconductor device manufacturing method
JPH0755878A (ja) Ｋｇｄアレイ用テストソケット
GB2165694A (en) Semiconductor laser devices
CN103630824A (zh) 芯片同测系统
JPS5863144A (ja) ボンデイングワイヤ姿勢検査方法
KR970067733A (ko) 반도체 패키징 적용시 리드 프레임과 본딩 전선을 초음파 본딩하는 장치 및 방법
JPH0628273B2 (ja) Ｉｃ支持フィルムとそれを塔載したキャリア
CN111916992A (zh) 半导体封装和lidar发射单元
KR100300497B1 (ko) 몰딩후 불량 반도체 패키지 검출 방법
US6391666B2 (en) Method for identifying defective elements in array molding of semiconductor packaging
US8993965B2 (en) Infrared sensor array and manufacturing method of infrared sensor
US4109269A (en) Opto-coupler semiconductor device
JPS6366945A (ja) ワイヤボンデイング不良検出方法およびこれに用いる装置
US6543127B1 (en) Coplanarity inspection at the singulation process
JPS5943733Y2 (ja) 半導体装置
JPH01260349A (ja) Ｉｃリードピン曲がり検出方法
JPS6036939A (ja) 光電式煙感知器
JPS58186975A (ja) 連続組立受光素子
US7517723B2 (en) Method for fabricating a flip chip system in package
JP2821519B2 (ja) Ｉｃ支持フィルムの位置決め方法とそれを用いたｉｃチップの試験方法
JPH02246351A (ja) ワイヤボンディング不良検出方法
JPH0462998A (ja) 画像素子アレイチップの搭載方法
KR20260034021A (ko) 반도체 제조 장치, 페이스트상 접착제의 검사 방법 및 반도체 장치의 제조 방법
JP2937632B2 (ja) 電子部品の製造方法
JPS60200537A (ja) テスト専用端子付半導体装置