JPS5869961U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS5869961U
JPS5869961U JP1981165074U JP16507481U JPS5869961U JP S5869961 U JPS5869961 U JP S5869961U JP 1981165074 U JP1981165074 U JP 1981165074U JP 16507481 U JP16507481 U JP 16507481U JP S5869961 U JPS5869961 U JP S5869961U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
active element
fixed
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981165074U
Other languages
English (en)
Inventor
宮内　秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981165074U priority Critical patent/JPS5869961U/ja
Publication of JPS5869961U publication Critical patent/JPS5869961U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の混成集積回路の一例の回路図、第２図は
第１図に示す回路を実現した混成集積回路の平面図、第
３図は本考案の一実施例に使用する膜回路板の平面図、
第４図は本考案の一実施例の平面図である。 １・・・・・・接続用パッド、２・・・・・・能動素子
固着領域、３、　４．　５・・・・・・導体配線、６．
　７．　８．　９・・・・・・金属線、１０・・・・・
・絶縁基板、１１’、　　１２．　１３゜１４・・・・
・・識別マーク。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板に能動素子固着領域、抵抗領域、導体配線並び
    に接続用パッドが設けられ、能動素子が固着され、他の
    受動素子が固着されミ前記能動素子、前記受動素子、前
    記接続用パッド、前記導体配線等の間が金属線で接続さ
    れている構造の混成集積回路において、前記能動素子固
    着領域、導体配線並びに接続用パッドの前記金属線で接
    続されるべき箇所の対向する端部に同一形状で向い合せ
    た識別マークの組を少くとも一組設けたことを特徴Ｘす
    る混成集積回路。
JP1981165074U 1981-11-05 1981-11-05 混成集積回路 Pending JPS5869961U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981165074U JPS5869961U (ja) 1981-11-05 1981-11-05 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981165074U JPS5869961U (ja) 1981-11-05 1981-11-05 混成集積回路

Publications (1)

Publication Number Publication Date
JPS5869961U true JPS5869961U (ja) 1983-05-12

Family

ID=29957284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981165074U Pending JPS5869961U (ja) 1981-11-05 1981-11-05 混成集積回路

Country Status (1)

Country Link
JP (1) JPS5869961U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216859B2 (ja) * 1973-09-20 1977-05-12
JPS5378768A (en) * 1976-12-23 1978-07-12 Toshiba Corp Wire bonding method of semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216859B2 (ja) * 1973-09-20 1977-05-12
JPS5378768A (en) * 1976-12-23 1978-07-12 Toshiba Corp Wire bonding method of semiconductor element

Similar Documents

Publication Publication Date Title
JPS5869961U (ja) 混成集積回路
JPS60183439U (ja) 集積回路
JPS6099543U (ja) 電子装置の構造
JPS5822742U (ja) 半導体装置
JPS59123348U (ja) 混成集積回路装置
JPS6138954U (ja) 半導体装置
JPS5933254U (ja) 半導体装置
JPS59123347U (ja) 混成集積回路装置
JPS5858328U (ja) 電子部品
JPS5942982U (ja) 半導体パツケ−ジ試験用基板
JPS6127371U (ja) 混成集積回路
JPS6138952U (ja) 電子部品
JPS6138947U (ja) 半導体の回路基板構造
JPS5846473U (ja) 印刷配線パタ−ン
JPS5842940U (ja) 混成集積回路装置
JPS60163744U (ja) 半導体集積回路装置
JPS60116268U (ja) ジヤンパ用ネツトワ−ク装置
JPS60169860U (ja) 混成集積回路
JPS5954956U (ja) 半導体パツケ−ジ
JPS5846472U (ja) プリント配線基板
JPS5817726U (ja) キ−回路基板
JPS58114049U (ja) 半導体装置
JPS60109354U (ja) 混成集積回路装置
JPS6094861U (ja) 印刷回路装置
JPS5914338U (ja) 混成集積回路