JPS5883157U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS5883157U
JPS5883157U JP1981178184U JP17818481U JPS5883157U JP S5883157 U JPS5883157 U JP S5883157U JP 1981178184 U JP1981178184 U JP 1981178184U JP 17818481 U JP17818481 U JP 17818481U JP S5883157 U JPS5883157 U JP S5883157U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed
encapsulated semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981178184U
Other languages
English (en)
Inventor
富田　行雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981178184U priority Critical patent/JPS5883157U/ja
Publication of JPS5883157U publication Critical patent/JPS5883157U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の樹脂封止半導体装置の一例の断面図、第
２図は本考案の一実施例の断面図、第３図は本考案の他
の実施例の断面図である。 １−・・・・・金属フレーム、２・・・・・・半導体チ
ップ、３・・・・・・金属線、４・・・・・・樹脂、５
・・・・・・外部リード、６・・・・・・半田、７・・
・・・・金属フレーム１と樹脂４の境界部、８・・・・
・・金属フレーム１と外部リード５の境界部、９１１１
１６１ｉｅ８シリコン片。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属製のリードフレームに半導体チップを搭載し、金属
    線で前記半導体チップの電極と外部リードとを接続し、
    樹脂封止した樹脂封止半導体装置において、前記金属線
    の一端と前記外部リードの接続点との間あるいは前記金
    属線の他端と前記半導体チップの電極との間の少（とも
    いづれか一方にシリコン片が設けられて樹脂封止されて
    いることを特徴とする樹脂封止半導体装置。
JP1981178184U 1981-11-30 1981-11-30 樹脂封止半導体装置 Pending JPS5883157U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981178184U JPS5883157U (ja) 1981-11-30 1981-11-30 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981178184U JPS5883157U (ja) 1981-11-30 1981-11-30 樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
JPS5883157U true JPS5883157U (ja) 1983-06-06

Family

ID=29972749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981178184U Pending JPS5883157U (ja) 1981-11-30 1981-11-30 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS5883157U (ja)

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