JPS5887336U - 蝕刻装置 - Google Patents

蝕刻装置

Info

Publication number
JPS5887336U
JPS5887336U JP18304881U JP18304881U JPS5887336U JP S5887336 U JPS5887336 U JP S5887336U JP 18304881 U JP18304881 U JP 18304881U JP 18304881 U JP18304881 U JP 18304881U JP S5887336 U JPS5887336 U JP S5887336U
Authority
JP
Japan
Prior art keywords
jig
etching device
etching
etched
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18304881U
Other languages
English (en)
Other versions
JPS642439Y2 (ja
Inventor
克美 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP18304881U priority Critical patent/JPS5887336U/ja
Publication of JPS5887336U publication Critical patent/JPS5887336U/ja
Application granted granted Critical
Publication of JPS642439Y2 publication Critical patent/JPS642439Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、従来の薄膜形成用の蝕刻装置を説明する為の
断面図、第２図は本考案の一実施例を説明する為の斜視
図、第３図ｉ第２図に示した本考案の一実施例を更に詳
細に説明する為の断面図である。 面図において、１１，１３，２３，３２・・・治具、１
２．３３．３７．３９・・・Ｏリング、１４・・・容器
、１５．２１．４１・・・蝕刻液、１６．３１・・・シ
リコンウェハ、１７・・・Ａｕパターン、２２・・・ガ
ラス還流器、２４．３８・・・円筒形突起、２５・・・
ヒータ、２６・・・通気筒、２７・・・冷却管、２８・
・・冷却水の導入口、２９・・・冷却水の導出口、３４
．４０−押え具、３５・・・メネジ、３６・・・結合子
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 蝕刻液を内部に満すための第１の治具に開口部を設け、
    この開口部を通して被蝕刻物の一主面側のみが前記蝕刻
    液にさらされるように、前記被蝕刻物を前記第１の治具
    に固定するための第２の治具を設けたことを特徴とする
    蝕刻装置。
JP18304881U 1981-12-09 1981-12-09 蝕刻装置 Granted JPS5887336U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18304881U JPS5887336U (ja) 1981-12-09 1981-12-09 蝕刻装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18304881U JPS5887336U (ja) 1981-12-09 1981-12-09 蝕刻装置

Publications (2)

Publication Number Publication Date
JPS5887336U true JPS5887336U (ja) 1983-06-14
JPS642439Y2 JPS642439Y2 (ja) 1989-01-20

Family

ID=29981963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18304881U Granted JPS5887336U (ja) 1981-12-09 1981-12-09 蝕刻装置

Country Status (1)

Country Link
JP (1) JPS5887336U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5970336U (ja) * 1982-10-30 1984-05-12 日本電信電話株式会社 エツチング装置
JPS6482654A (en) * 1987-09-25 1989-03-28 Toshiba Corp Manufacture of semiconductor device and equipment therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227368A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Selection etching method
JPS533922U (ja) * 1976-06-28 1978-01-14
JPS54152661U (ja) * 1978-04-14 1979-10-24

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227368A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Selection etching method
JPS533922U (ja) * 1976-06-28 1978-01-14
JPS54152661U (ja) * 1978-04-14 1979-10-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5970336U (ja) * 1982-10-30 1984-05-12 日本電信電話株式会社 エツチング装置
JPS6482654A (en) * 1987-09-25 1989-03-28 Toshiba Corp Manufacture of semiconductor device and equipment therefor

Also Published As

Publication number Publication date
JPS642439Y2 (ja) 1989-01-20

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