JPS5899837U - 半導体バツケ−ジ - Google Patents

半導体バツケ−ジ

Info

Publication number
JPS5899837U
JPS5899837U JP1981196482U JP19648281U JPS5899837U JP S5899837 U JPS5899837 U JP S5899837U JP 1981196482 U JP1981196482 U JP 1981196482U JP 19648281 U JP19648281 U JP 19648281U JP S5899837 U JPS5899837 U JP S5899837U
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor bag
metal plate
bag
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981196482U
Other languages
English (en)
Inventor
祐一 長谷川
吉田　志年司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1981196482U priority Critical patent/JPS5899837U/ja
Publication of JPS5899837U publication Critical patent/JPS5899837U/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は一般的なセラミックパッケージの構造を示す断
面図、第２図は従来の封止用金属板の断面図、第３図は
従来の封止部の要部断面図、第４図は本考案の一実施例
、第５図は本考案にがかる封止部の要部断面図である。 １・・・・・・セラミック基板、２・・・・・・半導体
チップ、３・・・・・・外部リード、４・・・・・・ワ
イヤ、５・・・・・・封止剤、６．８・・・・・・封止
用金属板、７・・・・・・金メッキ層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チップを収容したセラミック容器の開口部に、側
    面のめ貴金属メッキが施されていない封止用金属板を配
    置し、これを金−錫ろう剤等の封止剤により封着してな
    ることを特徴とする半導体パッケージ。
JP1981196482U 1981-12-26 1981-12-26 半導体バツケ−ジ Pending JPS5899837U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981196482U JPS5899837U (ja) 1981-12-26 1981-12-26 半導体バツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981196482U JPS5899837U (ja) 1981-12-26 1981-12-26 半導体バツケ−ジ

Publications (1)

Publication Number Publication Date
JPS5899837U true JPS5899837U (ja) 1983-07-07

Family

ID=30109722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981196482U Pending JPS5899837U (ja) 1981-12-26 1981-12-26 半導体バツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5899837U (ja)

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