JPS5913608A - 金属窒化物薄膜の製造方法 - Google Patents

金属窒化物薄膜の製造方法

Info

Publication number
JPS5913608A
JPS5913608A JP11991482A JP11991482A JPS5913608A JP S5913608 A JPS5913608 A JP S5913608A JP 11991482 A JP11991482 A JP 11991482A JP 11991482 A JP11991482 A JP 11991482A JP S5913608 A JPS5913608 A JP S5913608A
Authority
JP
Japan
Prior art keywords
bias voltage
nitride film
thin metallic
metallic nitride
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11991482A
Other languages
English (en)
Japanese (ja)
Other versions
JPS627263B2 (de
Inventor
Shuichi Kanamori
金森 周一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP11991482A priority Critical patent/JPS5913608A/ja
Publication of JPS5913608A publication Critical patent/JPS5913608A/ja
Publication of JPS627263B2 publication Critical patent/JPS627263B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11991482A 1982-07-12 1982-07-12 金属窒化物薄膜の製造方法 Granted JPS5913608A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11991482A JPS5913608A (ja) 1982-07-12 1982-07-12 金属窒化物薄膜の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11991482A JPS5913608A (ja) 1982-07-12 1982-07-12 金属窒化物薄膜の製造方法

Publications (2)

Publication Number Publication Date
JPS5913608A true JPS5913608A (ja) 1984-01-24
JPS627263B2 JPS627263B2 (de) 1987-02-16

Family

ID=14773308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11991482A Granted JPS5913608A (ja) 1982-07-12 1982-07-12 金属窒化物薄膜の製造方法

Country Status (1)

Country Link
JP (1) JPS5913608A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393861A (ja) * 1986-10-06 1988-04-25 Nec Corp 低応力薄膜の堆積方法
JPS6415366A (en) * 1987-07-09 1989-01-19 Matsushita Electric Industrial Co Ltd Preparation of composition modified nitrided alloy film
JPH02138456A (ja) * 1987-06-30 1990-05-28 Hitachi Ltd スパツタリング方法と装置および応用製品
JP2007005423A (ja) * 2005-06-22 2007-01-11 Fuji Electric Device Technology Co Ltd 半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538947A (en) * 1978-09-12 1980-03-18 Fujitsu Ltd Forming method of metallic compound coating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538947A (en) * 1978-09-12 1980-03-18 Fujitsu Ltd Forming method of metallic compound coating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393861A (ja) * 1986-10-06 1988-04-25 Nec Corp 低応力薄膜の堆積方法
JPH02138456A (ja) * 1987-06-30 1990-05-28 Hitachi Ltd スパツタリング方法と装置および応用製品
JPS6415366A (en) * 1987-07-09 1989-01-19 Matsushita Electric Industrial Co Ltd Preparation of composition modified nitrided alloy film
JP2007005423A (ja) * 2005-06-22 2007-01-11 Fuji Electric Device Technology Co Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS627263B2 (de) 1987-02-16

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