JPS59162014A - セラミツクス製切断用受台 - Google Patents

セラミツクス製切断用受台

Info

Publication number
JPS59162014A
JPS59162014A JP58036352A JP3635283A JPS59162014A JP S59162014 A JPS59162014 A JP S59162014A JP 58036352 A JP58036352 A JP 58036352A JP 3635283 A JP3635283 A JP 3635283A JP S59162014 A JPS59162014 A JP S59162014A
Authority
JP
Japan
Prior art keywords
pedestal
cutting
silicon wafer
wafer
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58036352A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311962B2 (2
Inventor
和夫 近藤
大野　美勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tokushu Togyo KK
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Nippon Tokushu Togyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd, Nippon Tokushu Togyo KK filed Critical NGK Spark Plug Co Ltd
Priority to JP58036352A priority Critical patent/JPS59162014A/ja
Publication of JPS59162014A publication Critical patent/JPS59162014A/ja
Publication of JPS6311962B2 publication Critical patent/JPS6311962B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP58036352A 1983-03-04 1983-03-04 セラミツクス製切断用受台 Granted JPS59162014A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58036352A JPS59162014A (ja) 1983-03-04 1983-03-04 セラミツクス製切断用受台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58036352A JPS59162014A (ja) 1983-03-04 1983-03-04 セラミツクス製切断用受台

Publications (2)

Publication Number Publication Date
JPS59162014A true JPS59162014A (ja) 1984-09-12
JPS6311962B2 JPS6311962B2 (2) 1988-03-16

Family

ID=12467442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58036352A Granted JPS59162014A (ja) 1983-03-04 1983-03-04 セラミツクス製切断用受台

Country Status (1)

Country Link
JP (1) JPS59162014A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166008U (2) * 1986-04-10 1987-10-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166008U (2) * 1986-04-10 1987-10-21

Also Published As

Publication number Publication date
JPS6311962B2 (2) 1988-03-16

Similar Documents

Publication Publication Date Title
JP5713684B2 (ja) Ｌｅｄ発光素子用複合材料基板、その製造方法及びｌｅｄ発光素子
US6293854B1 (en) Dresser for polishing cloth and manufacturing method therefor
EP0118225B1 (en) Diamond abrasive products
JPH0596401A (ja) 気相合成ダイヤモンド被覆切削工具およびその製造法
EP0301492A1 (en) Method for bonding cubic boron nitride sintered compact
JP2829522B2 (ja) 被覆ダイヤモンド砥粒およびその製法
JPH0482185B2 (2)
EP0223249B1 (en) Mounting beam for preparing wafers
KR101891189B1 (ko) 연마 공구 및 그 제조방법 그리고 연마물의 제조방법
JPS59162014A (ja) セラミツクス製切断用受台
JP2001351961A (ja) Ｓｉウェハ搬送治具及びその製造方法
JP2010109081A (ja) Ｌｅｄ発光素子用金属基複合材料基板及びそれを用いたｌｅｄ発光素子
JPH0912328A (ja) ホイールカッター及びその製造方法
CN108161773B (zh) 陶瓷结合剂磨具
JPS6294263A (ja) カツタ−ブレ−ドおよびその製造方法
JP2012038948A (ja) Ｌｅｄ発光素子用金属基複合材料基板、その製造方法及びｌｅｄ発光素子。
SE469467B (sv) Saett att vid isostatisk pressning foerse en poroes kropp med ett foer en glasomslutning ogenomtraengligt skikt
US20250282689A1 (en) Multi-component device and method of making a multi-component device
KR20230085089A (ko) 비트리파이드 본드 지석
JPH04367529A (ja) ガラス成形用治工具の製造方法
JP2010247287A (ja) 炭化珪素単結晶基板の製造方法
JPH04357120A (ja) ガラス成形用治工具の使用方法
JPH085010Y2 (ja) 焼結保持体部を有する超砥粒ビトリファイド砥石
JPH0747571A (ja) 半導体樹脂封止用材料のタブレット成形用型
JP2000072453A (ja) ガラスモールド成形用型及びその製造方法