JPS59181546A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS59181546A
JPS59181546A JP59059366A JP5936684A JPS59181546A JP S59181546 A JPS59181546 A JP S59181546A JP 59059366 A JP59059366 A JP 59059366A JP 5936684 A JP5936684 A JP 5936684A JP S59181546 A JPS59181546 A JP S59181546A
Authority
JP
Japan
Prior art keywords
wire
cut
clamper
tool
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59059366A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327853B2 (2
Inventor
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP59059366A priority Critical patent/JPS59181546A/ja
Publication of JPS59181546A publication Critical patent/JPS59181546A/ja
Publication of JPS6327853B2 publication Critical patent/JPS6327853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP59059366A 1984-03-29 1984-03-29 ワイヤボンデイング方法 Granted JPS59181546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59059366A JPS59181546A (ja) 1984-03-29 1984-03-29 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59059366A JPS59181546A (ja) 1984-03-29 1984-03-29 ワイヤボンデイング方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP54165260A Division JPS6026300B2 (ja) 1979-12-18 1979-12-18 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59181546A true JPS59181546A (ja) 1984-10-16
JPS6327853B2 JPS6327853B2 (2) 1988-06-06

Family

ID=13111193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59059366A Granted JPS59181546A (ja) 1984-03-29 1984-03-29 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59181546A (2)

Also Published As

Publication number Publication date
JPS6327853B2 (2) 1988-06-06

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