JPS59189158A - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物Info
- Publication number
- JPS59189158A JPS59189158A JP6233283A JP6233283A JPS59189158A JP S59189158 A JPS59189158 A JP S59189158A JP 6233283 A JP6233283 A JP 6233283A JP 6233283 A JP6233283 A JP 6233283A JP S59189158 A JPS59189158 A JP S59189158A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- compd
- silicone
- compounds
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6233283A JPS59189158A (ja) | 1983-04-11 | 1983-04-11 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6233283A JPS59189158A (ja) | 1983-04-11 | 1983-04-11 | 熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59189158A true JPS59189158A (ja) | 1984-10-26 |
| JPS6332807B2 JPS6332807B2 (da) | 1988-07-01 |
Family
ID=13197069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6233283A Granted JPS59189158A (ja) | 1983-04-11 | 1983-04-11 | 熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189158A (da) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285246A (ja) * | 1985-06-13 | 1986-12-16 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| US5034436A (en) * | 1989-02-24 | 1991-07-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor sealing epoxy resin composition |
| JPH0710968A (ja) * | 1993-06-07 | 1995-01-13 | Ciba Geigy Ag | アドバンスメント触媒を含むエポキシ樹脂混合物 |
-
1983
- 1983-04-11 JP JP6233283A patent/JPS59189158A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285246A (ja) * | 1985-06-13 | 1986-12-16 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| US5034436A (en) * | 1989-02-24 | 1991-07-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor sealing epoxy resin composition |
| JPH0710968A (ja) * | 1993-06-07 | 1995-01-13 | Ciba Geigy Ag | アドバンスメント触媒を含むエポキシ樹脂混合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6332807B2 (da) | 1988-07-01 |
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