JPS59208754A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59208754A
JPS59208754A JP58083077A JP8307783A JPS59208754A JP S59208754 A JPS59208754 A JP S59208754A JP 58083077 A JP58083077 A JP 58083077A JP 8307783 A JP8307783 A JP 8307783A JP S59208754 A JPS59208754 A JP S59208754A
Authority
JP
Japan
Prior art keywords
transistor
metallized
transistor chip
capacity
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58083077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6360923B2 (cs
Inventor
Osamu Shiozaki
修 塩崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58083077A priority Critical patent/JPS59208754A/ja
Publication of JPS59208754A publication Critical patent/JPS59208754A/ja
Publication of JPS6360923B2 publication Critical patent/JPS6360923B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Microwave Amplifiers (AREA)
JP58083077A 1983-05-12 1983-05-12 半導体装置 Granted JPS59208754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58083077A JPS59208754A (ja) 1983-05-12 1983-05-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58083077A JPS59208754A (ja) 1983-05-12 1983-05-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS59208754A true JPS59208754A (ja) 1984-11-27
JPS6360923B2 JPS6360923B2 (cs) 1988-11-25

Family

ID=13792110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58083077A Granted JPS59208754A (ja) 1983-05-12 1983-05-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS59208754A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335430U (cs) * 1989-08-11 1991-04-08

Also Published As

Publication number Publication date
JPS6360923B2 (cs) 1988-11-25

Similar Documents

Publication Publication Date Title
JP3674780B2 (ja) 高周波半導体装置
US4298846A (en) Semiconductor device
JPS6135714B2 (cs)
JP2003115732A (ja) 半導体装置
JP2000504490A (ja) 絶縁基板上に高周波バイポーラトランジスタを備える半導体装置
JP2738701B2 (ja) 高周波増幅回路
JP3744828B2 (ja) 半導体装置
JPS59208754A (ja) 半導体装置
JPH10256850A (ja) 半導体装置及び高周波電力増幅器
JP2000101067A (ja) 半導体装置および集積回路装置
JPS6364081B2 (cs)
JPH0697203A (ja) 半導体装置
JPS6035247Y2 (ja) 半導体装置
JP2606487B2 (ja) 半導体装置
JPS5929377Y2 (ja) 高周波高出力トランジスタ装置
JP2701644B2 (ja) 半導体装置
JPS6032749Y2 (ja) チップ形静電容量素子
JP3096046B2 (ja) マイクロ波半導体装置
JP3392744B2 (ja) モジュール型集積回路装置
JP2624370B2 (ja) 高周波集積回路
JPH066150A (ja) 高周波トランジスタ回路
JPH02140969A (ja) 半導体集積回路装置
JPH0578184B2 (cs)
JPS647682B2 (cs)
JPH0363315B2 (cs)