JPS59208862A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59208862A
JPS59208862A JP58082739A JP8273983A JPS59208862A JP S59208862 A JPS59208862 A JP S59208862A JP 58082739 A JP58082739 A JP 58082739A JP 8273983 A JP8273983 A JP 8273983A JP S59208862 A JPS59208862 A JP S59208862A
Authority
JP
Japan
Prior art keywords
neutrons
boron
semiconductor device
resin
rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58082739A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0324785B2 (mo
Inventor
Michiko Tsuchimoto
槌本　道子
Hiroshi Doi
土井　紘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP58082739A priority Critical patent/JPS59208862A/ja
Publication of JPS59208862A publication Critical patent/JPS59208862A/ja
Publication of JPH0324785B2 publication Critical patent/JPH0324785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58082739A 1983-05-13 1983-05-13 半導体装置 Granted JPS59208862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58082739A JPS59208862A (ja) 1983-05-13 1983-05-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58082739A JPS59208862A (ja) 1983-05-13 1983-05-13 半導体装置

Publications (2)

Publication Number Publication Date
JPS59208862A true JPS59208862A (ja) 1984-11-27
JPH0324785B2 JPH0324785B2 (mo) 1991-04-04

Family

ID=13782780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58082739A Granted JPS59208862A (ja) 1983-05-13 1983-05-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS59208862A (mo)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267504A (ja) * 1992-03-18 1993-10-15 Shin Etsu Chem Co Ltd 樹脂組成物及びこの樹脂組成物で封止又は被覆した半導体装置
US6255719B1 (en) 1998-06-05 2001-07-03 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including thermal neutron absorption material
JP2008172054A (ja) * 2007-01-12 2008-07-24 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP2008195756A (ja) * 2007-02-08 2008-08-28 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
EP2850656A4 (en) * 2012-05-15 2015-11-11 Cypress Semiconductor Corp SOFT-ERROR-RESISTANT SWITCHING
EP2997595A4 (en) * 2013-05-16 2017-01-25 National Institute Of Aerospace Associates Radiation hardened microelectronic chip packaging technology
US10262951B2 (en) 2013-05-16 2019-04-16 National Institute Of Aerospace Associates Radiation hardened microelectronic chip packaging technology

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7138481B2 (ja) * 2018-05-30 2022-09-16 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267504A (ja) * 1992-03-18 1993-10-15 Shin Etsu Chem Co Ltd 樹脂組成物及びこの樹脂組成物で封止又は被覆した半導体装置
US6255719B1 (en) 1998-06-05 2001-07-03 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including thermal neutron absorption material
JP2008172054A (ja) * 2007-01-12 2008-07-24 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP2008195756A (ja) * 2007-02-08 2008-08-28 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物及び半導体装置
EP2850656A4 (en) * 2012-05-15 2015-11-11 Cypress Semiconductor Corp SOFT-ERROR-RESISTANT SWITCHING
EP3780090A1 (en) * 2012-05-15 2021-02-17 Cypress Semiconductor Corporation Soft error resistant circuitry
EP2997595A4 (en) * 2013-05-16 2017-01-25 National Institute Of Aerospace Associates Radiation hardened microelectronic chip packaging technology
US10262951B2 (en) 2013-05-16 2019-04-16 National Institute Of Aerospace Associates Radiation hardened microelectronic chip packaging technology

Also Published As

Publication number Publication date
JPH0324785B2 (mo) 1991-04-04

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