JPS592155U - 樹脂封止集積回路 - Google Patents

樹脂封止集積回路

Info

Publication number
JPS592155U
JPS592155U JP1982097581U JP9758182U JPS592155U JP S592155 U JPS592155 U JP S592155U JP 1982097581 U JP1982097581 U JP 1982097581U JP 9758182 U JP9758182 U JP 9758182U JP S592155 U JPS592155 U JP S592155U
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
encapsulated integrated
circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982097581U
Other languages
English (en)
Japanese (ja)
Other versions
JPS635250Y2 (2
Inventor
幸仁 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982097581U priority Critical patent/JPS592155U/ja
Publication of JPS592155U publication Critical patent/JPS592155U/ja
Application granted granted Critical
Publication of JPS635250Y2 publication Critical patent/JPS635250Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1982097581U 1982-06-29 1982-06-29 樹脂封止集積回路 Granted JPS592155U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982097581U JPS592155U (ja) 1982-06-29 1982-06-29 樹脂封止集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982097581U JPS592155U (ja) 1982-06-29 1982-06-29 樹脂封止集積回路

Publications (2)

Publication Number Publication Date
JPS592155U true JPS592155U (ja) 1984-01-09
JPS635250Y2 JPS635250Y2 (2) 1988-02-12

Family

ID=30232052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982097581U Granted JPS592155U (ja) 1982-06-29 1982-06-29 樹脂封止集積回路

Country Status (1)

Country Link
JP (1) JPS592155U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009610A (ja) * 2010-06-24 2012-01-12 Mitsubishi Electric Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659A (en) * 1977-07-05 1979-02-03 Matsushita Electric Ind Co Ltd Astable multivibrator
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659A (en) * 1977-07-05 1979-02-03 Matsushita Electric Ind Co Ltd Astable multivibrator
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012009610A (ja) * 2010-06-24 2012-01-12 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS635250Y2 (2) 1988-02-12

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